FR2477360B1 - Procede pour le depot selectif, par voie chimique et/ou galvanique, de revetements metalliques, en particulier pour la fabrication de circuits imprimes - Google Patents
Procede pour le depot selectif, par voie chimique et/ou galvanique, de revetements metalliques, en particulier pour la fabrication de circuits imprimesInfo
- Publication number
- FR2477360B1 FR2477360B1 FR8104102A FR8104102A FR2477360B1 FR 2477360 B1 FR2477360 B1 FR 2477360B1 FR 8104102 A FR8104102 A FR 8104102A FR 8104102 A FR8104102 A FR 8104102A FR 2477360 B1 FR2477360 B1 FR 2477360B1
- Authority
- FR
- France
- Prior art keywords
- manufacture
- printed circuits
- metal coatings
- selective chemical
- galvanic deposition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 230000008021 deposition Effects 0.000 title 1
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
- 239000000126 substance Substances 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
- C23C18/1605—Process or apparatus coating on selected surface areas by masking
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
- C23C18/1651—Two or more layers only obtained by electroless plating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
- C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
- H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0175—Inorganic, non-metallic layer, e.g. resist or dielectric for printed capacitor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0344—Electroless sublayer, e.g. Ni, Co, Cd or Ag; Transferred electroless sublayer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0315—Oxidising metal
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Electrochemistry (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Electroplating Methods And Accessories (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Printing Plates And Materials Therefor (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19803008434 DE3008434A1 (de) | 1980-03-03 | 1980-03-03 | Verfahren zur selektiven chemischen und/oder galvanischen abscheidung von metallueberzuegen, insbesondere zur herstellung von gedruckten schaltungen |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2477360A1 FR2477360A1 (fr) | 1981-09-04 |
FR2477360B1 true FR2477360B1 (fr) | 1985-06-28 |
Family
ID=6096345
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR8104102A Expired FR2477360B1 (fr) | 1980-03-03 | 1981-03-02 | Procede pour le depot selectif, par voie chimique et/ou galvanique, de revetements metalliques, en particulier pour la fabrication de circuits imprimes |
Country Status (6)
Country | Link |
---|---|
JP (1) | JPS56135996A (fr) |
DE (1) | DE3008434A1 (fr) |
FR (1) | FR2477360B1 (fr) |
GB (1) | GB2070647B (fr) |
IE (1) | IE50821B1 (fr) |
IT (1) | IT1135186B (fr) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59186390A (ja) * | 1983-04-07 | 1984-10-23 | 株式会社サト−セン | プリント配線板の製造方法 |
EP0150733A3 (fr) * | 1984-01-26 | 1987-01-14 | LeaRonal, Inc. | Procédé de fabrication de circuit imprimé |
JPS60176293A (ja) * | 1984-02-22 | 1985-09-10 | 新神戸電機株式会社 | 印刷配線板の製造法 |
DE3840199C2 (de) * | 1988-11-29 | 1994-12-01 | Heraeus Noblelight Gmbh | Verfahren zur Strukturierung von bei der stromlosen Metallisierung katalytisch aktiven Metallschichten mittels UV-Strahlung |
DE4008482A1 (de) * | 1990-03-16 | 1991-09-19 | Asea Brown Boveri | Galvanisierungsverfahren |
JPH0555069U (ja) * | 1991-12-25 | 1993-07-23 | 松下電器産業株式会社 | 回転体の回転速度検出装置 |
US5354583A (en) * | 1992-11-09 | 1994-10-11 | Martin Marietta Energy Systems, Inc. | Apparatus and method for selective area deposition of thin films on electrically biased substrates |
TW369672B (en) | 1997-07-28 | 1999-09-11 | Hitachi Ltd | Wiring board and its manufacturing process, and electrolysis-free electroplating method |
JP5850353B2 (ja) | 2011-08-18 | 2016-02-03 | アップル インコーポレイテッド | 陽極酸化及びめっき表面処理 |
US9683305B2 (en) | 2011-12-20 | 2017-06-20 | Apple Inc. | Metal surface and process for treating a metal surface |
US10300658B2 (en) * | 2012-05-03 | 2019-05-28 | Apple Inc. | Crack resistant plastic enclosure structures |
DE102019220458A1 (de) * | 2019-12-20 | 2021-06-24 | Vitesco Technologies Germany Gmbh | Verfahren zur Herstellung einer Leiterplatte und Leiterplatte |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB829263A (en) * | 1957-02-08 | 1960-03-02 | Sperry Rand Corp | Method of making printed circuits |
DE1277642B (de) * | 1964-01-14 | 1968-09-12 | Bayer Ag | Verfahren zum Schutz von metallischen Oberflaechen gegen Metallabscheidung in chemischen Metallisierungsbaedern |
US3485665A (en) * | 1967-08-22 | 1969-12-23 | Western Electric Co | Selective chemical deposition of thin-film interconnections and contacts |
DE2920940A1 (de) * | 1979-05-21 | 1980-12-04 | Schering Ag | Verfahren zur herstellung von gedruckten schaltungen |
-
1980
- 1980-03-03 DE DE19803008434 patent/DE3008434A1/de active Granted
-
1981
- 1981-01-27 IT IT19345/81A patent/IT1135186B/it active
- 1981-03-02 FR FR8104102A patent/FR2477360B1/fr not_active Expired
- 1981-03-02 GB GB8106533A patent/GB2070647B/en not_active Expired
- 1981-03-03 JP JP2945881A patent/JPS56135996A/ja active Granted
- 1981-03-03 IE IE447/81A patent/IE50821B1/en unknown
Also Published As
Publication number | Publication date |
---|---|
IE50821B1 (en) | 1986-07-23 |
GB2070647B (en) | 1984-02-22 |
DE3008434C2 (fr) | 1988-02-25 |
JPS6257120B2 (fr) | 1987-11-30 |
IT1135186B (it) | 1986-08-20 |
IE810447L (en) | 1981-09-03 |
JPS56135996A (en) | 1981-10-23 |
DE3008434A1 (de) | 1981-09-17 |
IT8119345A0 (it) | 1981-01-27 |
GB2070647A (en) | 1981-09-09 |
FR2477360A1 (fr) | 1981-09-04 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |