BE893683A - Composition pour activer le depot chimique de nickel, condensateur ceramique obtenu avec cette composition et procede de fabrication dudit condensateur - Google Patents

Composition pour activer le depot chimique de nickel, condensateur ceramique obtenu avec cette composition et procede de fabrication dudit condensateur

Info

Publication number
BE893683A
BE893683A BE0/208477A BE208477A BE893683A BE 893683 A BE893683 A BE 893683A BE 0/208477 A BE0/208477 A BE 0/208477A BE 208477 A BE208477 A BE 208477A BE 893683 A BE893683 A BE 893683A
Authority
BE
Belgium
Prior art keywords
composition
capacitor
activating
nickel
manufacturing
Prior art date
Application number
BE0/208477A
Other languages
English (en)
Inventor
J P Maher
Original Assignee
Sprague Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sprague Electric Co filed Critical Sprague Electric Co
Publication of BE893683A publication Critical patent/BE893683A/fr

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
    • C23C18/1862—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by radiant energy
    • C23C18/1865—Heat
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
    • C23C18/1872—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment
    • C23C18/1886—Multistep pretreatment
    • C23C18/1889—Multistep pretreatment with use of metal first

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Ceramic Capacitors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
BE0/208477A 1981-07-06 1982-06-28 Composition pour activer le depot chimique de nickel, condensateur ceramique obtenu avec cette composition et procede de fabrication dudit condensateur BE893683A (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/280,044 US4425378A (en) 1981-07-06 1981-07-06 Electroless nickel plating activator composition a method for using and a ceramic capacitor made therewith

Publications (1)

Publication Number Publication Date
BE893683A true BE893683A (fr) 1982-10-18

Family

ID=23071396

Family Applications (1)

Application Number Title Priority Date Filing Date
BE0/208477A BE893683A (fr) 1981-07-06 1982-06-28 Composition pour activer le depot chimique de nickel, condensateur ceramique obtenu avec cette composition et procede de fabrication dudit condensateur

Country Status (5)

Country Link
US (1) US4425378A (fr)
JP (1) JPS5816062A (fr)
BE (1) BE893683A (fr)
CA (1) CA1156802A (fr)
FR (1) FR2508932B1 (fr)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4910049A (en) * 1986-12-15 1990-03-20 International Business Machines Corporation Conditioning a dielectric substrate for plating thereon
US4806159A (en) * 1987-07-16 1989-02-21 Sprague Electric Company Electro-nickel plating activator composition, a method for using and a capacitor made therewith
JP2839513B2 (ja) * 1988-03-15 1998-12-16 株式会社東芝 バンプの形成方法
US5158604A (en) * 1991-07-01 1992-10-27 Monsanto Company Viscous electroless plating solutions
JPH05255994A (ja) * 1992-03-10 1993-10-05 Natl House Ind Co Ltd 天 井
US5367430A (en) * 1992-10-21 1994-11-22 Presidio Components, Inc. Monolithic multiple capacitor
JPH06248748A (ja) * 1993-03-01 1994-09-06 Natl House Ind Co Ltd 天井構造
JPH0667639U (ja) * 1993-03-01 1994-09-22 ナショナル住宅産業株式会社 天井構造
JPH06248747A (ja) * 1993-03-01 1994-09-06 Natl House Ind Co Ltd 天井構造
JP3058063B2 (ja) * 1995-10-18 2000-07-04 株式会社村田製作所 無電解めっきのための活性化触媒液および無電解めっき方法
JP3111891B2 (ja) * 1996-04-09 2000-11-27 株式会社村田製作所 無電解めっきのための活性化触媒液および無電解めっき方法
US6232144B1 (en) * 1997-06-30 2001-05-15 Littelfuse, Inc. Nickel barrier end termination and method
US6406743B1 (en) 1997-07-10 2002-06-18 Industrial Technology Research Institute Nickel-silicide formation by electroless Ni deposition on polysilicon
BR0210147A (pt) * 2001-06-04 2004-06-08 Qinetiq Ltd Métodos para preparar um material de substrato, para preparar um substrato, para depositar um material sobre um substrato em um padrão definido pelo usuário através de uma reação catalìtica e para galvanizar metal sobre um substrato em um padrão definido pelo usuário através de um processo autocatalìtico, e, formulação de tinta
US7152291B2 (en) 2002-04-15 2006-12-26 Avx Corporation Method for forming plated terminations
KR101559036B1 (ko) * 2011-06-02 2015-10-08 가부시키가이샤 무라타 세이사쿠쇼 유전체 세라믹 및 단판 콘덴서
TWI613177B (zh) * 2011-11-16 2018-02-01 製陶技術股份有限公司 製造一基材的方法
WO2018186804A1 (fr) * 2017-04-04 2018-10-11 Nanyang Technological University Objet plaqué et son procédé de formation

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL298179A (fr) 1962-09-20
US3681261A (en) 1970-07-27 1972-08-01 Owens Illinois Inc Resistors,compositions,pastes,and method of making and using same
US3741780A (en) 1970-11-04 1973-06-26 Du Pont Metallizing compositions containing bismuthate glass-ceramic conductor binder
US4150995A (en) 1977-11-23 1979-04-24 Okuno Chemical Industry Co., Ltd. Vitreous enamel composition containing palladium powder
US4243710A (en) 1978-12-06 1981-01-06 Ferro Corporation Thermoplastic electrode ink for the manufacture of ceramic multi-layer capacitor
US4259409A (en) * 1980-03-06 1981-03-31 Ses, Incorporated Electroless plating process for glass or ceramic bodies and product

Also Published As

Publication number Publication date
CA1156802A (fr) 1983-11-15
FR2508932A1 (fr) 1983-01-07
US4425378A (en) 1984-01-10
FR2508932B1 (fr) 1986-11-21
JPS5816062A (ja) 1983-01-29

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Legal Events

Date Code Title Description
RE Patent lapsed

Owner name: MRA LABORATORIES INC.

Effective date: 19920630