JP5850353B2 - 陽極酸化及びめっき表面処理 - Google Patents
陽極酸化及びめっき表面処理 Download PDFInfo
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- JP5850353B2 JP5850353B2 JP2014526051A JP2014526051A JP5850353B2 JP 5850353 B2 JP5850353 B2 JP 5850353B2 JP 2014526051 A JP2014526051 A JP 2014526051A JP 2014526051 A JP2014526051 A JP 2014526051A JP 5850353 B2 JP5850353 B2 JP 5850353B2
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- layer
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- plating
- anodized
- surface region
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
- C25D5/022—Electroplating of selected surface areas using masking means
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
- C23C18/1605—Process or apparatus coating on selected surface areas by masking
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/54—Contact plating, i.e. electroless electrochemical plating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
- C25D11/02—Anodisation
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
- C25D11/02—Anodisation
- C25D11/022—Anodisation on selected surface areas
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electrochemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Electroplating Methods And Accessories (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
- Chemically Coating (AREA)
Description
Claims (18)
- 第1表面領域及び第2表面領域を有する金属部品上に構造を形成する方法であって、前記方法は、
前記第1表面領域上に多層構造を形成する工程であって、前記多層構造を形成する工程は、
露出表面を有する中間金属層を前記金属部品の前記第1表面領域上にめっきする工程、
研磨プロセスを用いて前記露出表面を処理する工程によって、研磨表面の幾何形状を有する研磨表面を前記中間金属層上に形成する工程、及び
前記中間金属層の前記研磨表面に対応する、研磨表面の幾何形状を有する上面を含み、ニッケル、亜鉛、クロムのうち少なくとも1つを含む最上部金属層を、前記研磨表面上にめっきする工程、を含む、形成する工程と、
陽極酸化プロセスを用いて、前記金属部品の前記第2表面領域上に陽極酸化層を形成する工程と、を含む、方法。 - 前記多層構造を形成する工程が、前記陽極酸化層を形成する工程の前に実行される、請求項1に記載の方法。
- 前記陽極酸化層を形成する工程が、前記多層構造を形成する工程の前に実行される、請求項1に記載の方法。
- 前記多層構造を形成する工程に先立って、前記第2表面領域をマスクする工程を更に含む、請求項1に記載の方法。
- 前記多層構造を形成する工程は、前記中間層を形成する工程に先立って、少なくとも他の中間層をめっきする工程を更に含み、前記多層構造の金属層は3〜6層を含む、請求項1に記載の方法。
- 前記研磨表面を形成する工程は、前記中間金属層を鏡面様の光沢にまで研磨する、請求項1に記載の方法。
- 前記陽極酸化層は前記多層構造に直接隣接し、曲線である共有縁部で交わる、請求項1に記載の方法。
- 前記最上部金属層の前記上面及び前記陽極酸化層の上面を、前記めっき層の前記上面と前記陽極酸化層の前記上面とが実質的に面一になるように研磨する工程によって、均一な表面を形成する工程を更に含む、請求項1に記載の方法。
- 前記陽極酸化層を形成する工程に先立って、前記最上部金属層上にトップコーティングを提供する工程であって、前記トップコーティングは前記陽極酸化プロセスから前記最上部金属層を保護するように構成される、提供する工程を更に含む、請求項1に記載の方法。
- 前記中間金属層をめっきする工程又は前記最上部金属層をめっきする工程が、電気めっきプロセス及び無電解めっきプロセスのうちの少なくとも一方を含む、請求項1に記載の方法。
- 前記多層構造は、ロゴ、文字又は図形の形であり、前記陽極酸化層に直接隣接する、請求項1に記載の方法。
- 第1表面領域及び第2表面領域を有する部品上に構造を形成する方法であって、前記方法は、
陽極酸化プロセスを用いて前記金属部品の前記第1表面領域及び前記第2表面領域上に陽極酸化層を形成する工程と、
前記第1表面領域において前記陽極酸化層の一部を除去する工程によって、前記第1表面領域を露出させる工程と、
前記露出させた第1表面領域上に多層構造を形成する工程と、を含み、
前記多層構造を形成する工程は、
露出表面を有する中間金属層を、前記金属部品の前記第1表面領域上にめっきする工程、
研磨プロセスを用いて前記露出表面を処理する工程によって、研磨表面の幾何形状を有する研磨表面を形成する工程、及び
前記中間金属層に対応する、研磨表面の幾何形状を有する上面を含み、ニッケル、亜鉛、クロムのうち少なくとも1つを含む最上部金属層を、前記研磨表面上にめっきする工程、
を含む、方法。 - 前記第1表面領域及び前記第2表面領域が互いに隣接する、請求項12に記載の方法。
- 前記陽極酸化層を形成する工程に先立って、前記第1表面領域及び前記第2表面領域が表面仕上げプロセスに曝露される、請求項12に記載の方法。
- 前記めっき層の前記上面及び前記陽極酸化層の上面を、前記めっき層の前記上面と前記陽極酸化層の前記上面とが実質的に面一になるように研磨する工程を更に含む、請求項12に記載の方法。
- 前記第1表面領域において前記陽極酸化層の一部を除去する工程が、前記陽極酸化層の前記一部をエッチングする工程を含む、請求項12に記載の方法。
- 第1表面領域及び第2表面領域を有する金属部品上に構造を形成する方法であって、前記方法は、
前記第1表面領域及び前記第2表面領域上に多層構造を形成する工程であって、前記多層構造を形成する工程は、
露出表面を有する中間金属層を、前記第1表面領域及び前記第2表面領域上にめっきする工程、
研磨プロセスを用いて前記露出表面を処理する工程によって、研磨表面の幾何形状を有する研磨表面を前記中間金属層上に形成する工程、及び
前記中間金属層の前記研磨表面に対応する、研磨表面の幾何形状を有する上面を含み、ニッケル、亜鉛、クロムのうち少なくとも1つを含む最上部金属層を、前記研磨表面上にめっきする工程、を含む、形成する工程と、
前記第1表面領域において前記多層構造の一部を除去する工程によって、前記第1表面領域を露出させる工程と、
陽極酸化プロセスを用いて、前記金属部品の前記第1表面領域上に陽極酸化層を形成する工程と、
を含む、方法。 - 前記第1表面領域において前記多層構造の一部を除去する工程が、前記多層構造の前記一部をエッチングする工程を含む、請求項17に記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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US201161525057P | 2011-08-18 | 2011-08-18 | |
US61/525,057 | 2011-08-18 | ||
PCT/US2012/049192 WO2013025352A1 (en) | 2011-08-18 | 2012-08-01 | Anodization and plating surface treatments |
Publications (2)
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JP2014521842A JP2014521842A (ja) | 2014-08-28 |
JP5850353B2 true JP5850353B2 (ja) | 2016-02-03 |
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JP2014526051A Expired - Fee Related JP5850353B2 (ja) | 2011-08-18 | 2012-08-01 | 陽極酸化及びめっき表面処理 |
Country Status (6)
Country | Link |
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US (1) | US9663869B2 (ja) |
EP (1) | EP2744928B1 (ja) |
JP (1) | JP5850353B2 (ja) |
KR (1) | KR101594723B1 (ja) |
CN (1) | CN103732804B (ja) |
WO (1) | WO2013025352A1 (ja) |
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KR20100032957A (ko) * | 2008-09-19 | 2010-03-29 | (주)크레타하이테크 | 금속 케이스 제조방법 |
CN101922010B (zh) * | 2009-06-16 | 2012-11-21 | 比亚迪股份有限公司 | 一种铝合金表面处理方法 |
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US10392718B2 (en) | 2009-09-04 | 2019-08-27 | Apple Inc. | Anodization and polish surface treatment |
CN102752982A (zh) | 2011-04-22 | 2012-10-24 | 深圳富泰宏精密工业有限公司 | 装饰性外壳及其制作方法 |
US9644283B2 (en) | 2011-09-30 | 2017-05-09 | Apple Inc. | Laser texturizing and anodization surface treatment |
US20130153427A1 (en) | 2011-12-20 | 2013-06-20 | Apple Inc. | Metal Surface and Process for Treating a Metal Surface |
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2012
- 2012-08-01 CN CN201280039932.6A patent/CN103732804B/zh active Active
- 2012-08-01 JP JP2014526051A patent/JP5850353B2/ja not_active Expired - Fee Related
- 2012-08-01 WO PCT/US2012/049192 patent/WO2013025352A1/en unknown
- 2012-08-01 KR KR1020147006733A patent/KR101594723B1/ko active IP Right Grant
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Also Published As
Publication number | Publication date |
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EP2744928B1 (en) | 2018-01-10 |
US9663869B2 (en) | 2017-05-30 |
KR20140048327A (ko) | 2014-04-23 |
WO2013025352A1 (en) | 2013-02-21 |
CN103732804A (zh) | 2014-04-16 |
JP2014521842A (ja) | 2014-08-28 |
KR101594723B1 (ko) | 2016-02-16 |
CN103732804B (zh) | 2017-03-15 |
US20130043135A1 (en) | 2013-02-21 |
EP2744928A1 (en) | 2014-06-25 |
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