JPS5612725A - Method and apparatus for setting position of wafer in projection aligner - Google Patents

Method and apparatus for setting position of wafer in projection aligner

Info

Publication number
JPS5612725A
JPS5612725A JP8692679A JP8692679A JPS5612725A JP S5612725 A JPS5612725 A JP S5612725A JP 8692679 A JP8692679 A JP 8692679A JP 8692679 A JP8692679 A JP 8692679A JP S5612725 A JPS5612725 A JP S5612725A
Authority
JP
Japan
Prior art keywords
wafer
parallelism
reference value
paralleling
projection aligner
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8692679A
Other languages
Japanese (ja)
Inventor
Hiroshi Nishizuka
Mitsuhiro Morita
Takayoshi Oosakatani
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP8692679A priority Critical patent/JPS5612725A/en
Priority to GB8040959A priority patent/GB2063523B/en
Priority to GB8040960A priority patent/GB2063524B/en
Priority to GB7936237A priority patent/GB2035610B/en
Priority to DE19792942388 priority patent/DE2942388A1/en
Priority to US06/087,387 priority patent/US4298273A/en
Publication of JPS5612725A publication Critical patent/JPS5612725A/en
Priority to SG40884A priority patent/SG40884G/en
Priority to SG404/84A priority patent/SG40484G/en
Priority to HK356/85A priority patent/HK35685A/en
Priority to HK361/85A priority patent/HK36185A/en
Priority to HK684/85A priority patent/HK68485A/en
Priority to MY669/85A priority patent/MY8500669A/en
Priority to MY663/85A priority patent/MY8500663A/en
Priority to MY1985670A priority patent/MY8500670A/en
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26

Abstract

PURPOSE:To increase the resolution in the periphery of the wafer by aligning the wafer surface on a reference surface with a projection aligner, measuring the parallelism of the wafer, and paralleling the wafer so that the parallelism lies within a specified reference value. CONSTITUTION:The wafer 5 is attracted to a wafter chuck 2 by vacuum, and contacted with leveling pads 1A-1C. After the paralleling alignment, the wafer is lowered about 50mum. Then, the distances d1-d3 to the surface of the wafer are measured by air micrometers 7A-7C, thereby the parallelism is obtained. If the parallelism does not lie within a reference value, the leveling is repeated several times until the parallelism reaches the specified reference value. When the reference value has been attained, exposure is performed. If the air micrometer 7D is provided at the portion of the paralleling alignment portion 3 corresponding to the center of the wafer 5, the warp and curve of the wafer can be also measured.
JP8692679A 1978-10-20 1979-07-11 Method and apparatus for setting position of wafer in projection aligner Pending JPS5612725A (en)

Priority Applications (14)

Application Number Priority Date Filing Date Title
JP8692679A JPS5612725A (en) 1979-07-11 1979-07-11 Method and apparatus for setting position of wafer in projection aligner
GB8040959A GB2063523B (en) 1978-10-20 1979-10-18 Wafer position setting apparatus
GB8040960A GB2063524B (en) 1978-10-20 1979-10-18 Method of positioning a wafer in a projection aligner
GB7936237A GB2035610B (en) 1978-10-20 1979-10-18 Wafer projection aligner
DE19792942388 DE2942388A1 (en) 1978-10-20 1979-10-19 SEMICONDUCTOR DEVICE POSITIONING DEVICE
US06/087,387 US4298273A (en) 1978-10-20 1979-10-22 Projection aligner and method of positioning a wafer
SG404/84A SG40484G (en) 1978-10-20 1984-06-04 Projection aligner
SG40884A SG40884G (en) 1978-10-20 1984-06-04 A method of positioning a wafer in a projection aligner
HK356/85A HK35685A (en) 1978-10-20 1985-05-09 Projection aligner
HK361/85A HK36185A (en) 1978-10-20 1985-05-09 Wafer position setting apparatus
HK684/85A HK68485A (en) 1978-10-20 1985-09-12 A method of positioning a wafer in a projection aligner
MY669/85A MY8500669A (en) 1978-10-20 1985-12-30 Water position setting apparatus
MY663/85A MY8500663A (en) 1978-10-20 1985-12-30 Projection aligner
MY1985670A MY8500670A (en) 1978-10-20 1985-12-31 A method of positioning a wafer in a protection aligner

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8692679A JPS5612725A (en) 1979-07-11 1979-07-11 Method and apparatus for setting position of wafer in projection aligner

Related Child Applications (2)

Application Number Title Priority Date Filing Date
JP60099569A Division JPS611019A (en) 1985-05-13 1985-05-13 Exposing method
JP60099570A Division JPS611020A (en) 1985-05-13 1985-05-13 Exposing apparatus

Publications (1)

Publication Number Publication Date
JPS5612725A true JPS5612725A (en) 1981-02-07

Family

ID=13900458

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8692679A Pending JPS5612725A (en) 1978-10-20 1979-07-11 Method and apparatus for setting position of wafer in projection aligner

Country Status (1)

Country Link
JP (1) JPS5612725A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62198121A (en) * 1986-02-26 1987-09-01 Toshiba Corp Exposing apparatus

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4888871A (en) * 1972-02-02 1973-11-21

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4888871A (en) * 1972-02-02 1973-11-21

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62198121A (en) * 1986-02-26 1987-09-01 Toshiba Corp Exposing apparatus

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