JPS5784306A - Method for providing gap - Google Patents

Method for providing gap

Info

Publication number
JPS5784306A
JPS5784306A JP55159602A JP15960280A JPS5784306A JP S5784306 A JPS5784306 A JP S5784306A JP 55159602 A JP55159602 A JP 55159602A JP 15960280 A JP15960280 A JP 15960280A JP S5784306 A JPS5784306 A JP S5784306A
Authority
JP
Japan
Prior art keywords
wafer
displacement
gages
distance
mask
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP55159602A
Other languages
Japanese (ja)
Inventor
Kosuke Oshio
Tadao Hirakawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP55159602A priority Critical patent/JPS5784306A/en
Publication of JPS5784306A publication Critical patent/JPS5784306A/en
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B5/00—Measuring arrangements characterised by the use of mechanical techniques
    • G01B5/14—Measuring arrangements characterised by the use of mechanical techniques for measuring distance or clearance between spaced objects or spaced apertures

Abstract

PURPOSE:To establish the gap between two bodies accurately without contact by fixing the second body on a substrate facing the first body, providing displacement gages on the substrate, and moving the substrate by reading the values of said displacement gages being observed. CONSTITUTION:A wafer 5 is placed on a holding surface of a chuck 4 and sucked and held. The three displacement gages 9 corresponding to auxiliary driving shafts 8 are provided on the peripheral side of the holding surface so that the wafer 5 is located between the gages and the height of the gages is lower than the height of the wafer 5. Then a reference plate body 10 whose size is wide enough to cover the displacement gages is placed on the wafer 5. The distance between said displacement gage 9 and a horizontal surface 11, i.g., the difference in thickness g1-g3 between the wafer and each displacement gage 9 is measured by each displacement gage 9. Then, the reference plate body 10 is removed, the chuck 4 is lifted by a main diriving shaft 7, and a mask 1 and the wafer 5 are brought to close proximity. The distance between each displacement gage 9 and the mask 1 is made to be distance obtained by adding the distance of the gap set between the mask 1 and the wafer 5 to the difference in thickness g1-g3.
JP55159602A 1980-11-14 1980-11-14 Method for providing gap Pending JPS5784306A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55159602A JPS5784306A (en) 1980-11-14 1980-11-14 Method for providing gap

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55159602A JPS5784306A (en) 1980-11-14 1980-11-14 Method for providing gap

Publications (1)

Publication Number Publication Date
JPS5784306A true JPS5784306A (en) 1982-05-26

Family

ID=15697282

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55159602A Pending JPS5784306A (en) 1980-11-14 1980-11-14 Method for providing gap

Country Status (1)

Country Link
JP (1) JPS5784306A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59107515A (en) * 1982-12-13 1984-06-21 Hitachi Ltd Gap control type exposure method
JPS62277726A (en) * 1986-05-27 1987-12-02 Canon Inc Parallelism forming device
JPS62279629A (en) * 1986-05-28 1987-12-04 Hitachi Ltd Exposure equipment
EP0633505A1 (en) * 1993-07-08 1995-01-11 Ushiodenki Kabushiki Kaisha Process and device for adjusting the distance between a workpiece and a mask
EP0722122A1 (en) * 1995-01-10 1996-07-17 Ushiodenki Kabushiki Kaisha Process and device for adjusting the distance between a workpiece and a mask
CN104266568A (en) * 2014-09-30 2015-01-07 成都易态科技有限公司 Tool for detecting distance between tubular filter element large end face and mounting hole end face
CN108369093A (en) * 2016-01-20 2018-08-03 三菱重工业株式会社 Gap measuring apparatus and gap measuring method

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59107515A (en) * 1982-12-13 1984-06-21 Hitachi Ltd Gap control type exposure method
JPH0454963B2 (en) * 1982-12-13 1992-09-01 Hitachi Ltd
JPS62277726A (en) * 1986-05-27 1987-12-02 Canon Inc Parallelism forming device
JPS62279629A (en) * 1986-05-28 1987-12-04 Hitachi Ltd Exposure equipment
EP0633505A1 (en) * 1993-07-08 1995-01-11 Ushiodenki Kabushiki Kaisha Process and device for adjusting the distance between a workpiece and a mask
EP0722122A1 (en) * 1995-01-10 1996-07-17 Ushiodenki Kabushiki Kaisha Process and device for adjusting the distance between a workpiece and a mask
CN104266568A (en) * 2014-09-30 2015-01-07 成都易态科技有限公司 Tool for detecting distance between tubular filter element large end face and mounting hole end face
CN108369093A (en) * 2016-01-20 2018-08-03 三菱重工业株式会社 Gap measuring apparatus and gap measuring method
US11054253B2 (en) 2016-01-20 2021-07-06 Mitsubishi Heavy Industries, Ltd. Gap measurement device and gap measurement method

Similar Documents

Publication Publication Date Title
JPS5780532A (en) Semiconductor load converter
TW371348B (en) Reticle for fabricating semiconductor device
JPS5784306A (en) Method for providing gap
ATE88021T1 (en) LIQUID CRYSTAL DISPLAY DEVICE AND METHOD OF MAKING SUCH DISPLAY DEVICE.
GB751253A (en) Improvements in or relating to the preparation of printing plates
JPS577931A (en) Method for measuring gap
JPS57108656A (en) Detecting method of internal defect in thin steel plate
JPS51111993A (en) Apparatus for fabricating thin work as semiconductor or the like
JPS5334883A (en) Sheet and plate laminates with reliefed surface and method for their production
ATE39035T1 (en) ARRANGEMENT FOR COMPENSATION OF CORROSION EFFECTS IN SEMICONDUCTOR INTEGRATED CIRCUITS.
JPS569141A (en) Supporting method for article
JPS6421920A (en) Close-up type exposure device
JPS577139A (en) Splitting of semiconductor wafer
JPS52143771A (en) Aligning method for reticle datum plane
JPS57109335A (en) Positional matching method between mask substrate and wafer
JPS6275209A (en) Method and instrument for measuring dimension of plate type body
JPS56118607A (en) Inspection method for secondary negative
JPS5712650A (en) Positioning structure of screen printing machine
JPS6471663A (en) Lapping method for gaas wafer
JPS52156551A (en) Semiconductor wafer breaking method
JPS52125352A (en) Standard sample vessel for measuring thickness of coatings
SU1403914A1 (en) Method for determining mobility of minority carriers
JPS5360184A (en) Production of semiconductor wafer
JPS5730330A (en) Mask aligner
JPS55158652A (en) Fitting structure for element