JPS56112923A - Curable resin composition - Google Patents
Curable resin compositionInfo
- Publication number
- JPS56112923A JPS56112923A JP1574680A JP1574680A JPS56112923A JP S56112923 A JPS56112923 A JP S56112923A JP 1574680 A JP1574680 A JP 1574680A JP 1574680 A JP1574680 A JP 1574680A JP S56112923 A JPS56112923 A JP S56112923A
- Authority
- JP
- Japan
- Prior art keywords
- acid ester
- polyfunctional
- anhydride
- cyanic acid
- curing agents
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011342 resin composition Substances 0.000 title 1
- XLJMAIOERFSOGZ-UHFFFAOYSA-N anhydrous cyanic acid Natural products OC#N XLJMAIOERFSOGZ-UHFFFAOYSA-N 0.000 abstract 3
- -1 cyanic acid ester Chemical class 0.000 abstract 3
- 150000008065 acid anhydrides Chemical class 0.000 abstract 2
- 239000003795 chemical substances by application Substances 0.000 abstract 2
- 229920005989 resin Polymers 0.000 abstract 2
- 239000011347 resin Substances 0.000 abstract 2
- UFKLQICEQCIWNE-UHFFFAOYSA-N (3,5-dicyanatophenyl) cyanate Chemical compound N#COC1=CC(OC#N)=CC(OC#N)=C1 UFKLQICEQCIWNE-UHFFFAOYSA-N 0.000 abstract 1
- QQZZMAPJAKOSNG-UHFFFAOYSA-N (3-cyanatophenyl) cyanate Chemical compound N#COC1=CC=CC(OC#N)=C1 QQZZMAPJAKOSNG-UHFFFAOYSA-N 0.000 abstract 1
- NOGFHTGYPKWWRX-UHFFFAOYSA-N 2,2,6,6-tetramethyloxan-4-one Chemical compound CC1(C)CC(=O)CC(C)(C)O1 NOGFHTGYPKWWRX-UHFFFAOYSA-N 0.000 abstract 1
- PEEHTFAAVSWFBL-UHFFFAOYSA-N Maleimide Chemical compound O=C1NC(=O)C=C1 PEEHTFAAVSWFBL-UHFFFAOYSA-N 0.000 abstract 1
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 abstract 1
- 125000000217 alkyl group Chemical group 0.000 abstract 1
- 239000004566 building material Substances 0.000 abstract 1
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 abstract 1
- 239000003822 epoxy resin Substances 0.000 abstract 1
- 229910052736 halogen Inorganic materials 0.000 abstract 1
- 150000002367 halogens Chemical class 0.000 abstract 1
- 238000002156 mixing Methods 0.000 abstract 1
- 239000003973 paint Substances 0.000 abstract 1
- 229920000647 polyepoxide Polymers 0.000 abstract 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1574680A JPS56112923A (en) | 1980-02-12 | 1980-02-12 | Curable resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1574680A JPS56112923A (en) | 1980-02-12 | 1980-02-12 | Curable resin composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS56112923A true JPS56112923A (en) | 1981-09-05 |
| JPS6248683B2 JPS6248683B2 (enrdf_load_stackoverflow) | 1987-10-15 |
Family
ID=11897322
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1574680A Granted JPS56112923A (en) | 1980-02-12 | 1980-02-12 | Curable resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS56112923A (enrdf_load_stackoverflow) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000336246A (ja) * | 1999-05-26 | 2000-12-05 | Matsushita Electric Works Ltd | 半導体封止用液状エポキシ樹脂組成物および半導体装置 |
| JP2000336245A (ja) * | 1999-05-26 | 2000-12-05 | Matsushita Electric Works Ltd | 半導体封止用液状エポキシ樹脂組成物および半導体装置 |
| JP2002317085A (ja) * | 2001-01-30 | 2002-10-31 | Hitachi Chem Co Ltd | 熱硬化性樹脂組成物及びその使用 |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01134385U (enrdf_load_stackoverflow) * | 1988-03-08 | 1989-09-13 | ||
| JPH08106966A (ja) * | 1994-10-05 | 1996-04-23 | Daiichi Denso Buhin Kk | 接続具の取付け構成体 |
| KR101762102B1 (ko) | 2015-02-03 | 2017-08-04 | 미츠비시 가스 가가쿠 가부시키가이샤 | 수지 조성물, 프리프레그, 금속박 피복 적층판, 수지 복합 시트, 및 프린트 배선판 |
-
1980
- 1980-02-12 JP JP1574680A patent/JPS56112923A/ja active Granted
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000336246A (ja) * | 1999-05-26 | 2000-12-05 | Matsushita Electric Works Ltd | 半導体封止用液状エポキシ樹脂組成物および半導体装置 |
| JP2000336245A (ja) * | 1999-05-26 | 2000-12-05 | Matsushita Electric Works Ltd | 半導体封止用液状エポキシ樹脂組成物および半導体装置 |
| JP2002317085A (ja) * | 2001-01-30 | 2002-10-31 | Hitachi Chem Co Ltd | 熱硬化性樹脂組成物及びその使用 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6248683B2 (enrdf_load_stackoverflow) | 1987-10-15 |
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