JPS5572054A - Preparation of semiconductor device - Google Patents

Preparation of semiconductor device

Info

Publication number
JPS5572054A
JPS5572054A JP14617178A JP14617178A JPS5572054A JP S5572054 A JPS5572054 A JP S5572054A JP 14617178 A JP14617178 A JP 14617178A JP 14617178 A JP14617178 A JP 14617178A JP S5572054 A JPS5572054 A JP S5572054A
Authority
JP
Japan
Prior art keywords
rod
wax
plastics
perfectly
gaps
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14617178A
Other languages
Japanese (ja)
Inventor
Shoichi Fujisada
Kazuya Kuguyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP14617178A priority Critical patent/JPS5572054A/en
Publication of JPS5572054A publication Critical patent/JPS5572054A/en
Pending legal-status Critical Current

Links

Landscapes

  • Dicing (AREA)

Abstract

PURPOSE: To prevent occurrence of crack due to dicing process, to enable it to be cut perfectly and to improve recovery rate, by covering surface of a semiconductor substrate with plastics.
CONSTITUTION: A wafer 11 is attached to a joining tape 12, and by perfectly cutting it from the direction of A', it is divided into a rod-like body 13. Plastics, such as wax 5, etc., is made to drip onto an entire surface of the rod-like body 13 and gaps among the rod-like bodies 13 are also filled with the plastics. After solidification of the wax, if it is perfectly (or completely) cut from the direction of B', since the gaps are filled with wax, force of a cutter 14 is dispersed and not applied separately on each individual rod-like body, and therefore, possible occurrence of crack of the wafer 11 is diminished. By removing by using an organic solvent and separating it from the joining tape, each individual pellet can be obtained separately.
COPYRIGHT: (C)1980,JPO&Japio
JP14617178A 1978-11-27 1978-11-27 Preparation of semiconductor device Pending JPS5572054A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14617178A JPS5572054A (en) 1978-11-27 1978-11-27 Preparation of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14617178A JPS5572054A (en) 1978-11-27 1978-11-27 Preparation of semiconductor device

Publications (1)

Publication Number Publication Date
JPS5572054A true JPS5572054A (en) 1980-05-30

Family

ID=15401731

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14617178A Pending JPS5572054A (en) 1978-11-27 1978-11-27 Preparation of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5572054A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62112333A (en) * 1985-11-11 1987-05-23 Stanley Electric Co Ltd Manufacture of minimold type semiconductor element

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62112333A (en) * 1985-11-11 1987-05-23 Stanley Electric Co Ltd Manufacture of minimold type semiconductor element

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