JPS5572054A - Preparation of semiconductor device - Google Patents
Preparation of semiconductor deviceInfo
- Publication number
- JPS5572054A JPS5572054A JP14617178A JP14617178A JPS5572054A JP S5572054 A JPS5572054 A JP S5572054A JP 14617178 A JP14617178 A JP 14617178A JP 14617178 A JP14617178 A JP 14617178A JP S5572054 A JPS5572054 A JP S5572054A
- Authority
- JP
- Japan
- Prior art keywords
- rod
- wax
- plastics
- perfectly
- gaps
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Dicing (AREA)
Abstract
PURPOSE: To prevent occurrence of crack due to dicing process, to enable it to be cut perfectly and to improve recovery rate, by covering surface of a semiconductor substrate with plastics.
CONSTITUTION: A wafer 11 is attached to a joining tape 12, and by perfectly cutting it from the direction of A', it is divided into a rod-like body 13. Plastics, such as wax 5, etc., is made to drip onto an entire surface of the rod-like body 13 and gaps among the rod-like bodies 13 are also filled with the plastics. After solidification of the wax, if it is perfectly (or completely) cut from the direction of B', since the gaps are filled with wax, force of a cutter 14 is dispersed and not applied separately on each individual rod-like body, and therefore, possible occurrence of crack of the wafer 11 is diminished. By removing by using an organic solvent and separating it from the joining tape, each individual pellet can be obtained separately.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14617178A JPS5572054A (en) | 1978-11-27 | 1978-11-27 | Preparation of semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14617178A JPS5572054A (en) | 1978-11-27 | 1978-11-27 | Preparation of semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5572054A true JPS5572054A (en) | 1980-05-30 |
Family
ID=15401731
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14617178A Pending JPS5572054A (en) | 1978-11-27 | 1978-11-27 | Preparation of semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5572054A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62112333A (en) * | 1985-11-11 | 1987-05-23 | Stanley Electric Co Ltd | Manufacture of minimold type semiconductor element |
-
1978
- 1978-11-27 JP JP14617178A patent/JPS5572054A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62112333A (en) * | 1985-11-11 | 1987-05-23 | Stanley Electric Co Ltd | Manufacture of minimold type semiconductor element |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS5226182A (en) | Manufacturing method of semi-conductor unit | |
JPS5572054A (en) | Preparation of semiconductor device | |
JPS5412563A (en) | Fabricating method of semiconductor crystals | |
JPS5572055A (en) | Preparation of semiconductor device | |
JPS5212575A (en) | Production method of semi-conductor device | |
JPS5441665A (en) | Manufacture for semiconductor device | |
JPS5469957A (en) | Production of semiconductor device | |
JPS5578544A (en) | Pelletization of semiconductor wafer | |
JPS53142877A (en) | Manufacture for compound semiconductor device | |
JPS53137685A (en) | Manufacture for semiconductor device | |
JPS51145082A (en) | Device of cutting running long composite material to a length of hard substrate | |
JPS5362462A (en) | Production of semiconductor divice | |
JPS5382174A (en) | Surface processing method for semiconductor device | |
JPS5429558A (en) | Manufacture for semiconductor device | |
JPS5376760A (en) | Semiconductor rectifying device | |
JPS5399869A (en) | Dividing method for semiconductor pellet | |
JPS5386158A (en) | Production of semiconductor device | |
JPS5286775A (en) | Bebeling method for semiconductor substrate | |
JPS5422775A (en) | Semiconductor device | |
JPS5378165A (en) | Cutting method for semiconductor substrate | |
JPS5366157A (en) | Method for semiconductor processing | |
JPS51135099A (en) | Device for removing attached matters from vessels | |
JPS54136173A (en) | Semiconductor device | |
JPS53138279A (en) | Semiconductor device | |
JPS5376743A (en) | Cutting method of semiconductor substrate |