JPS62112333A - Manufacture of minimold type semiconductor element - Google Patents

Abstract

PURPOSE:To produce homogeneous products with excellent yield by a method wherein semiconductor chips per column are molded to form the sections into mesa type; adhesive tapes are bonded on mold resins and substrates; the substrates and mold resin parts are simultaneously cut off by a dicer. CONSTITUTION:To manufacture a minimold type LED, multiple LED chips 13 are diebonded on a substrate 12 whereon through holes 11 are made in specified arrayal state in addition to metallic wire bonding process. Next, the chips 13 are sealed by transfer molding process to form resins 14 on the substrates 12 so that the section per column of resin 14 may be formed into mesa type. Successively adhesive sheet are bonded on the mold resins 14 and the substrates 12 for the substrates and resins to be cut off simultaneously by a dicer. Through these procedures, the metallic mold for resin molding process is provided with continuous mold type excavation and only one resin leading-in gate to improve the fluidity of resin.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to bonding a chip to a ceramic substrate,
This invention relates to a method of manufacturing a mini-mold type semiconductor element, which is molded with a resin and then cut with a dicer to produce a semiconductor element such as a light emitting diode (LIED).

1 Prior Art] For example, when manufacturing LEDs, as shown in Fig. 4, an LED chip is bonded to a ceramic substrate (bonding substrate) formed into a rectangular shape, and then sealed with resin B using a botting molding method. After that, the substrate A may be cut into individual products.

However, when manufactured in this manner, the molded resin tends to adhere to the electrode portions C formed in the through holes of the substrate A, resulting in poor yield. This is because resin must be placed in the mold before the bonded substrate A is mounted in the mold, and the resin easily enters the electrode portion C during the molding process.

Furthermore, when cutting the ceramic substrate Δ, a dicing saw with teeth of special dimensions and material is required, and cutting is difficult, resulting in poor mass productivity.

Furthermore, if the pyramidal substrate is attached to the mold by applying pressure in the 1 to 1-lance firm mold, there is a possibility that 1 or 1 scratches may occur on the substrate.

Note that although an LED is exemplified as a product, the same applies to other ICs. Furthermore, in the case of a square or rectangular shape with a wide surface rather than a strip shape, the resin will be partially potted for each required circuit section or for the chip Toden.

[Object of the Invention] An object of the present invention is to provide a method for manufacturing a mini-mold type semiconductor element with excellent productivity.

[Summary of the Invention] The present invention provides bonding of a large number of semiconductor chips such as LED chips to a substrate in which a large number of through holes are formed in a predetermined arrangement, and when covering these with resin, the cross section of each row becomes trapezoidal. This method is characterized by molding with resin so that the mold resin and the substrate have the following properties, and then applying an adhesive sheet to the mold resin and the substrate, and cutting the substrate portion and the mold resin portion at the same time using a dicer to obtain individual products.

[Example] Figures 1 and 2 show an example of the present invention, which is a case of a mini-mold type LEI. That is, a substrate 1 in which through-holes 11 serving as electrode portions are formed in a predetermined arrangement state.
A large number of LED chips 7'13 are bonded to 2 and gold wire wire bonding is performed.

Next, LED chip 1 is molded using a transfer mold.
Seal 3. In this case, the transfer mold may have a shape having a groove in which the resin flows linearly over the bonding plate.
Each row on the top is formed so that its cross section is trapezoidal.

Next, an adhesive sheet (not shown) is applied to the mold resin 14 and the substrate 12 so as to form the final product shape, and a dicer is used.
- Cut the substrate part and the resin part at the same time using the same cutting tool. This cut is the cut line j! , f
It is carried out along J2. After this, a shipping inspection is performed and the product is taped and shipped.

As a result, the mold used for molding the resin only needs to have a recess that forms a continuous mold shape and only one gate for resin inflow, unlike the conventional chip f5.
It is no longer necessary to provide a gate, the resin has good fluidity, and a homogeneous product with a high yield can be obtained. That is, the insufficient flow of the mold resin material and the generation of air bubbles, which tend to occur in minute molded parts, are eliminated, and the fluidity of the resin material within the mold is improved.

Although the above embodiment deals with one ED chip, the same applies to the two-chip case shown in FIG. It can also be applied to obtain a circuit having a certain function by molding circuit blocks densely on a printed circuit board of a hybrid IC on which semiconductor chips and other microcomponents are mounted, and then cutting the circuit blocks.

[Effects] (1) LE on bonding board (through-hole board)
By bonding the D chips at uniform intervals, the work becomes easier and mass productivity is improved.

(2) It is possible to manufacture many products at once using a simple molding method and mold fS construction.

(3) A large number of products can be manufactured from one substrate, and materials can be used effectively, contributing to improved productivity and loss-1 performance.

(4) During shipping inspection after cutting with a dicer, it is possible to turn on the product while it is attached to the sheet and check the voltage characteristics to prevent the product from falling apart.

(5) Shipping is possible using existing taping standards.

(6) Pudding 1 - Because it is bonded to a wiring board (glass-containing, etc.), a highly reliable product can be obtained even under high temperatures.

[Brief explanation of drawings]

FIG. 1 is a perspective view showing an embodiment of the method of the present invention, FIGS. 2 and 3 are perspective views showing the final product shape, and FIG. 4 is a perspective view for explaining the conventional method. 11... Through hole 12... Board 13.
・・LED chip 14・7-old resin 15・
...Gold wire (conductive wire) Procedural correction layer November 1988, 4-day

Claims (1)

[Claims] A large number of semiconductor chips such as LED chips are bonded to a substrate on which a large number of through holes are formed in a predetermined arrangement, and when covering them with resin, each row is molded with resin so that the cross section becomes trapezoidal. A method for manufacturing a mini-mold type semiconductor device, which comprises applying an adhesive sheet to a mold resin and a substrate, and simultaneously cutting the substrate portion and the mold resin portion using a dicer to obtain individual products.