JPS5572047A - Solder for semiconductor - Google Patents
Solder for semiconductorInfo
- Publication number
- JPS5572047A JPS5572047A JP14576878A JP14576878A JPS5572047A JP S5572047 A JPS5572047 A JP S5572047A JP 14576878 A JP14576878 A JP 14576878A JP 14576878 A JP14576878 A JP 14576878A JP S5572047 A JPS5572047 A JP S5572047A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- chip
- semiconductor
- alloy
- mechanical strength
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/35—Mechanical effects
- H01L2924/351—Thermal stress
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14576878A JPS5572047A (en) | 1978-11-25 | 1978-11-25 | Solder for semiconductor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14576878A JPS5572047A (en) | 1978-11-25 | 1978-11-25 | Solder for semiconductor |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5572047A true JPS5572047A (en) | 1980-05-30 |
Family
ID=15392704
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14576878A Pending JPS5572047A (en) | 1978-11-25 | 1978-11-25 | Solder for semiconductor |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5572047A (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5066614A (en) * | 1988-11-21 | 1991-11-19 | Honeywell Inc. | Method of manufacturing a leadframe having conductive elements preformed with solder bumps |
US5161729A (en) * | 1988-11-21 | 1992-11-10 | Honeywell Inc. | Package to semiconductor chip active interconnect site method |
-
1978
- 1978-11-25 JP JP14576878A patent/JPS5572047A/ja active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5066614A (en) * | 1988-11-21 | 1991-11-19 | Honeywell Inc. | Method of manufacturing a leadframe having conductive elements preformed with solder bumps |
US5161729A (en) * | 1988-11-21 | 1992-11-10 | Honeywell Inc. | Package to semiconductor chip active interconnect site method |
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