JPS5565443A - Manufacture of semiconductor device - Google Patents

Manufacture of semiconductor device

Info

Publication number
JPS5565443A
JPS5565443A JP13961578A JP13961578A JPS5565443A JP S5565443 A JPS5565443 A JP S5565443A JP 13961578 A JP13961578 A JP 13961578A JP 13961578 A JP13961578 A JP 13961578A JP S5565443 A JPS5565443 A JP S5565443A
Authority
JP
Japan
Prior art keywords
bonding unit
stem
heating device
heating
infrared ray
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13961578A
Other languages
English (en)
Inventor
Akira Inoue
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP13961578A priority Critical patent/JPS5565443A/ja
Publication of JPS5565443A publication Critical patent/JPS5565443A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85009—Pre-treatment of the connector or the bonding area
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
JP13961578A 1978-11-10 1978-11-10 Manufacture of semiconductor device Pending JPS5565443A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13961578A JPS5565443A (en) 1978-11-10 1978-11-10 Manufacture of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13961578A JPS5565443A (en) 1978-11-10 1978-11-10 Manufacture of semiconductor device

Publications (1)

Publication Number Publication Date
JPS5565443A true JPS5565443A (en) 1980-05-16

Family

ID=15249409

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13961578A Pending JPS5565443A (en) 1978-11-10 1978-11-10 Manufacture of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5565443A (ja)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4356384A (en) * 1980-03-03 1982-10-26 Arnon Gat Method and means for heat treating semiconductor material using high intensity CW lamps
JPS59172733A (ja) * 1983-03-22 1984-09-29 Toshiba Corp 半導体装置の製造方法
JPS6022328A (ja) * 1983-07-18 1985-02-04 Yamagata Nippon Denki Kk 半導体装置の製造方法
JPS6167926A (ja) * 1984-09-12 1986-04-08 Hitachi Tokyo Electronics Co Ltd ボンデイング方法
JPH03116741A (ja) * 1989-09-28 1991-05-17 Nippon Steel Corp 半導体のボンディング方法
US6384366B1 (en) * 2000-06-12 2002-05-07 Advanced Micro Devices, Inc. Top infrared heating for bonding operations
US8444044B2 (en) 2008-03-10 2013-05-21 Micron Technology, Inc. Apparatus and methods for forming wire bonds

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4356384A (en) * 1980-03-03 1982-10-26 Arnon Gat Method and means for heat treating semiconductor material using high intensity CW lamps
JPS59172733A (ja) * 1983-03-22 1984-09-29 Toshiba Corp 半導体装置の製造方法
JPS6022328A (ja) * 1983-07-18 1985-02-04 Yamagata Nippon Denki Kk 半導体装置の製造方法
JPH0218583B2 (ja) * 1983-07-18 1990-04-26 Yamagata Nippon Denki Kk
JPS6167926A (ja) * 1984-09-12 1986-04-08 Hitachi Tokyo Electronics Co Ltd ボンデイング方法
JPH03116741A (ja) * 1989-09-28 1991-05-17 Nippon Steel Corp 半導体のボンディング方法
US6384366B1 (en) * 2000-06-12 2002-05-07 Advanced Micro Devices, Inc. Top infrared heating for bonding operations
US8444044B2 (en) 2008-03-10 2013-05-21 Micron Technology, Inc. Apparatus and methods for forming wire bonds

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