JPS5556634A - Preparation of semiconductor device - Google Patents
Preparation of semiconductor deviceInfo
- Publication number
- JPS5556634A JPS5556634A JP13021278A JP13021278A JPS5556634A JP S5556634 A JPS5556634 A JP S5556634A JP 13021278 A JP13021278 A JP 13021278A JP 13021278 A JP13021278 A JP 13021278A JP S5556634 A JPS5556634 A JP S5556634A
- Authority
- JP
- Japan
- Prior art keywords
- film
- electrode
- reflection
- hole
- photo
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
PURPOSE: To avoid the generation of the deformation of a resist pattern formed, by eliminating the partial difference of photo-reflection factor by beforehand mounting a metallic film onto a surface of a semiconductor substrate before applying photo-resist on the surface.
CONSTITUTION: An upper portion of a semiconductor substrate 1 is coated with SiO2 film 2, an Al metal electrode 3 with a fixed shape is installed onto the film 2 and a SiO2 film 4 is gaseous phase-grown on the whole surface containing the electrode. The whole surface is covered with a photo-resist film 5, and selectively exposed and a hole with a fixed size is bored on the electrode 3, but the thickness of the film 5 decreases because reflection is little in a region B that there is no electrode 3 if the quantity of exposure is a small quantity at that time, and an unnecessary hole B' is produced if etching the film. Meanwhile, a hole A' smaller than a hole A, which must be bored, is formed owing to reflection in an electrode 3 portion if the quantity of exposure is too much. Thus, a bonding region C with a fixed size is obtained on the electrode 3 when reflection is uniformalized by beforehand coating a lower portion of the film 5 with a film 6 in Al or Cr.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13021278A JPS5556634A (en) | 1978-10-23 | 1978-10-23 | Preparation of semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13021278A JPS5556634A (en) | 1978-10-23 | 1978-10-23 | Preparation of semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5556634A true JPS5556634A (en) | 1980-04-25 |
Family
ID=15028763
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13021278A Pending JPS5556634A (en) | 1978-10-23 | 1978-10-23 | Preparation of semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5556634A (en) |
-
1978
- 1978-10-23 JP JP13021278A patent/JPS5556634A/en active Pending
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