JPS554917A - Resin-enclosed semi-conductor device - Google Patents

Resin-enclosed semi-conductor device

Info

Publication number
JPS554917A
JPS554917A JP7647278A JP7647278A JPS554917A JP S554917 A JPS554917 A JP S554917A JP 7647278 A JP7647278 A JP 7647278A JP 7647278 A JP7647278 A JP 7647278A JP S554917 A JPS554917 A JP S554917A
Authority
JP
Japan
Prior art keywords
chip
resin
manner
insulating
stress
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7647278A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6118862B2 (enExample
Inventor
Yoshiaki Wakashima
Hideo Inayoshi
Kunihiko Nishi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP7647278A priority Critical patent/JPS554917A/ja
Publication of JPS554917A publication Critical patent/JPS554917A/ja
Publication of JPS6118862B2 publication Critical patent/JPS6118862B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/581—Auxiliary members, e.g. flow barriers
    • H10W72/585—Alignment aids, e.g. alignment marks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP7647278A 1978-06-26 1978-06-26 Resin-enclosed semi-conductor device Granted JPS554917A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7647278A JPS554917A (en) 1978-06-26 1978-06-26 Resin-enclosed semi-conductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7647278A JPS554917A (en) 1978-06-26 1978-06-26 Resin-enclosed semi-conductor device

Publications (2)

Publication Number Publication Date
JPS554917A true JPS554917A (en) 1980-01-14
JPS6118862B2 JPS6118862B2 (enExample) 1986-05-14

Family

ID=13606109

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7647278A Granted JPS554917A (en) 1978-06-26 1978-06-26 Resin-enclosed semi-conductor device

Country Status (1)

Country Link
JP (1) JPS554917A (enExample)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5744558U (enExample) * 1980-08-27 1982-03-11
JPS57125541U (enExample) * 1981-01-30 1982-08-05
JPS58441U (ja) * 1981-06-25 1983-01-05 富士通株式会社 プラスチツクパツケ−ジ
US7789316B2 (en) 2007-03-23 2010-09-07 Fujitsu Limited Electronic device, electronic apparatus mounted with electronic device, article equipped with electronic device and method of producing electronic device
US7960215B2 (en) 2007-03-23 2011-06-14 Fujitsu Limited Electronic device, electronic apparatus mounted with electronic device, article equipped with electronic device and method of producing electronic device
US7982295B2 (en) 2007-03-23 2011-07-19 Fujitsu Limited Electronic device, electronic apparatus mounted with electronic device, article equipped with electronic device and method of producing electronic device

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5744558U (enExample) * 1980-08-27 1982-03-11
JPS57125541U (enExample) * 1981-01-30 1982-08-05
JPS58441U (ja) * 1981-06-25 1983-01-05 富士通株式会社 プラスチツクパツケ−ジ
US7789316B2 (en) 2007-03-23 2010-09-07 Fujitsu Limited Electronic device, electronic apparatus mounted with electronic device, article equipped with electronic device and method of producing electronic device
US7960215B2 (en) 2007-03-23 2011-06-14 Fujitsu Limited Electronic device, electronic apparatus mounted with electronic device, article equipped with electronic device and method of producing electronic device
US7982295B2 (en) 2007-03-23 2011-07-19 Fujitsu Limited Electronic device, electronic apparatus mounted with electronic device, article equipped with electronic device and method of producing electronic device

Also Published As

Publication number Publication date
JPS6118862B2 (enExample) 1986-05-14

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