JPS5548958A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS5548958A JPS5548958A JP12182878A JP12182878A JPS5548958A JP S5548958 A JPS5548958 A JP S5548958A JP 12182878 A JP12182878 A JP 12182878A JP 12182878 A JP12182878 A JP 12182878A JP S5548958 A JPS5548958 A JP S5548958A
- Authority
- JP
- Japan
- Prior art keywords
- type
- regions
- region
- separation region
- diffusion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/201—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of only components covered by H10D1/00 or H10D8/00, e.g. RLC circuits
- H10D84/204—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of only components covered by H10D1/00 or H10D8/00, e.g. RLC circuits of combinations of diodes or capacitors or resistors
- H10D84/221—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of only components covered by H10D1/00 or H10D8/00, e.g. RLC circuits of combinations of diodes or capacitors or resistors of only diodes
Landscapes
- Element Separation (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Bipolar Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12182878A JPS5548958A (en) | 1978-10-02 | 1978-10-02 | Semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12182878A JPS5548958A (en) | 1978-10-02 | 1978-10-02 | Semiconductor device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5548958A true JPS5548958A (en) | 1980-04-08 |
JPS6146972B2 JPS6146972B2 (enrdf_load_stackoverflow) | 1986-10-16 |
Family
ID=14820925
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12182878A Granted JPS5548958A (en) | 1978-10-02 | 1978-10-02 | Semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5548958A (enrdf_load_stackoverflow) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5893291A (ja) * | 1981-11-30 | 1983-06-02 | Fuji Electric Corp Res & Dev Ltd | 集積回路用ダイオ−ド |
JPS602557A (ja) * | 1983-03-01 | 1985-01-08 | ガ−バ−・サイエンテイフイツク・インコ−ポレ−テツド | シ−ト材料を断続的に前進させる装置及び方法 |
JPS6165060U (enrdf_load_stackoverflow) * | 1984-10-05 | 1986-05-02 | ||
JPS62204357U (enrdf_load_stackoverflow) * | 1986-06-18 | 1987-12-26 | ||
JPH02370A (ja) * | 1987-10-27 | 1990-01-05 | Nec Corp | 集積回路装置 |
JP2008186920A (ja) * | 2007-01-29 | 2008-08-14 | Mitsubishi Electric Corp | 半導体装置 |
JP2020007136A (ja) * | 2018-07-12 | 2020-01-16 | 本田技研工業株式会社 | シート体の切断方法及びその切断装置 |
-
1978
- 1978-10-02 JP JP12182878A patent/JPS5548958A/ja active Granted
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5893291A (ja) * | 1981-11-30 | 1983-06-02 | Fuji Electric Corp Res & Dev Ltd | 集積回路用ダイオ−ド |
JPS602557A (ja) * | 1983-03-01 | 1985-01-08 | ガ−バ−・サイエンテイフイツク・インコ−ポレ−テツド | シ−ト材料を断続的に前進させる装置及び方法 |
JPS6165060U (enrdf_load_stackoverflow) * | 1984-10-05 | 1986-05-02 | ||
JPS62204357U (enrdf_load_stackoverflow) * | 1986-06-18 | 1987-12-26 | ||
JPH02370A (ja) * | 1987-10-27 | 1990-01-05 | Nec Corp | 集積回路装置 |
JP2008186920A (ja) * | 2007-01-29 | 2008-08-14 | Mitsubishi Electric Corp | 半導体装置 |
JP2020007136A (ja) * | 2018-07-12 | 2020-01-16 | 本田技研工業株式会社 | シート体の切断方法及びその切断装置 |
Also Published As
Publication number | Publication date |
---|---|
JPS6146972B2 (enrdf_load_stackoverflow) | 1986-10-16 |
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