JPS5544749A - Substrate for mounting semiconductor device - Google Patents

Substrate for mounting semiconductor device

Info

Publication number
JPS5544749A
JPS5544749A JP11821578A JP11821578A JPS5544749A JP S5544749 A JPS5544749 A JP S5544749A JP 11821578 A JP11821578 A JP 11821578A JP 11821578 A JP11821578 A JP 11821578A JP S5544749 A JPS5544749 A JP S5544749A
Authority
JP
Japan
Prior art keywords
metalized
pattern
coating layer
substrate
outside lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11821578A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6226185B2 (enExample
Inventor
Eiji Hagimoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP11821578A priority Critical patent/JPS5544749A/ja
Publication of JPS5544749A publication Critical patent/JPS5544749A/ja
Publication of JPS6226185B2 publication Critical patent/JPS6226185B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP11821578A 1978-09-25 1978-09-25 Substrate for mounting semiconductor device Granted JPS5544749A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11821578A JPS5544749A (en) 1978-09-25 1978-09-25 Substrate for mounting semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11821578A JPS5544749A (en) 1978-09-25 1978-09-25 Substrate for mounting semiconductor device

Publications (2)

Publication Number Publication Date
JPS5544749A true JPS5544749A (en) 1980-03-29
JPS6226185B2 JPS6226185B2 (enExample) 1987-06-08

Family

ID=14731056

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11821578A Granted JPS5544749A (en) 1978-09-25 1978-09-25 Substrate for mounting semiconductor device

Country Status (1)

Country Link
JP (1) JPS5544749A (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5853853A (ja) * 1981-09-26 1983-03-30 Nec Corp 電子回路用構成体
JPS5961155A (ja) * 1982-09-30 1984-04-07 Fujitsu Ltd 半導体装置
JPS59211253A (ja) * 1983-05-17 1984-11-30 Matsushita Electronics Corp 電子部品パツケ−ジ

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52117066A (en) * 1976-03-27 1977-10-01 Toshiba Corp Semiconductor device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52117066A (en) * 1976-03-27 1977-10-01 Toshiba Corp Semiconductor device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5853853A (ja) * 1981-09-26 1983-03-30 Nec Corp 電子回路用構成体
JPS5961155A (ja) * 1982-09-30 1984-04-07 Fujitsu Ltd 半導体装置
JPS59211253A (ja) * 1983-05-17 1984-11-30 Matsushita Electronics Corp 電子部品パツケ−ジ

Also Published As

Publication number Publication date
JPS6226185B2 (enExample) 1987-06-08

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