JPS5543852A - Pellet bonding - Google Patents
Pellet bondingInfo
- Publication number
- JPS5543852A JPS5543852A JP11653778A JP11653778A JPS5543852A JP S5543852 A JPS5543852 A JP S5543852A JP 11653778 A JP11653778 A JP 11653778A JP 11653778 A JP11653778 A JP 11653778A JP S5543852 A JPS5543852 A JP S5543852A
- Authority
- JP
- Japan
- Prior art keywords
- pellet
- junction
- substrate
- flux
- brazing material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
- H01L2224/83193—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed on both the semiconductor or solid-state body and another item or body to be connected to the semiconductor or solid-state body
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11653778A JPS5543852A (en) | 1978-09-25 | 1978-09-25 | Pellet bonding |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11653778A JPS5543852A (en) | 1978-09-25 | 1978-09-25 | Pellet bonding |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5543852A true JPS5543852A (en) | 1980-03-27 |
Family
ID=14689571
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11653778A Pending JPS5543852A (en) | 1978-09-25 | 1978-09-25 | Pellet bonding |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5543852A (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62183131A (ja) * | 1986-02-06 | 1987-08-11 | Fuji Electric Co Ltd | 半導体装置の製造方法 |
JP2008010545A (ja) * | 2006-06-28 | 2008-01-17 | Mitsubishi Materials Corp | Au−Sn合金はんだペーストを用いて素子の接合面全面を基板に接合する方法 |
-
1978
- 1978-09-25 JP JP11653778A patent/JPS5543852A/ja active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62183131A (ja) * | 1986-02-06 | 1987-08-11 | Fuji Electric Co Ltd | 半導体装置の製造方法 |
JP2008010545A (ja) * | 2006-06-28 | 2008-01-17 | Mitsubishi Materials Corp | Au−Sn合金はんだペーストを用いて素子の接合面全面を基板に接合する方法 |
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