JPS5541706A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS5541706A JPS5541706A JP11379578A JP11379578A JPS5541706A JP S5541706 A JPS5541706 A JP S5541706A JP 11379578 A JP11379578 A JP 11379578A JP 11379578 A JP11379578 A JP 11379578A JP S5541706 A JPS5541706 A JP S5541706A
- Authority
- JP
- Japan
- Prior art keywords
- studs
- bump electrode
- heat generated
- junction part
- glass case
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11379578A JPS5541706A (en) | 1978-09-15 | 1978-09-15 | Semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11379578A JPS5541706A (en) | 1978-09-15 | 1978-09-15 | Semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5541706A true JPS5541706A (en) | 1980-03-24 |
Family
ID=14621270
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11379578A Pending JPS5541706A (en) | 1978-09-15 | 1978-09-15 | Semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5541706A (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62166549A (ja) * | 1986-01-20 | 1987-07-23 | Nec Corp | 半導体装置の製造方法 |
-
1978
- 1978-09-15 JP JP11379578A patent/JPS5541706A/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62166549A (ja) * | 1986-01-20 | 1987-07-23 | Nec Corp | 半導体装置の製造方法 |
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