JPS5538077B2 - - Google Patents
Info
- Publication number
- JPS5538077B2 JPS5538077B2 JP15251676A JP15251676A JPS5538077B2 JP S5538077 B2 JPS5538077 B2 JP S5538077B2 JP 15251676 A JP15251676 A JP 15251676A JP 15251676 A JP15251676 A JP 15251676A JP S5538077 B2 JPS5538077 B2 JP S5538077B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3415—Surface mounted components on both sides of the substrate or combined with lead-in-hole components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3468—Applying molten solder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/0969—Apertured conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1178—Means for venting or for letting gases escape
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
- H05K3/305—Affixing by adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Molten Solder (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15251676A JPS5376372A (en) | 1976-12-17 | 1976-12-17 | Device for attaching chip circuit parts |
DE19772755926 DE2755926A1 (de) | 1976-12-17 | 1977-12-15 | Schaltungsplatine sowie verfahren zu ihrer herstellung |
US05/861,447 US4139881A (en) | 1976-12-17 | 1977-12-16 | Circuit board assembly and method of manufacturing the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15251676A JPS5376372A (en) | 1976-12-17 | 1976-12-17 | Device for attaching chip circuit parts |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5376372A JPS5376372A (en) | 1978-07-06 |
JPS5538077B2 true JPS5538077B2 (ja) | 1980-10-02 |
Family
ID=15542144
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15251676A Granted JPS5376372A (en) | 1976-12-17 | 1976-12-17 | Device for attaching chip circuit parts |
Country Status (3)
Country | Link |
---|---|
US (1) | US4139881A (ja) |
JP (1) | JPS5376372A (ja) |
DE (1) | DE2755926A1 (ja) |
Families Citing this family (69)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5479469U (ja) * | 1977-11-17 | 1979-06-06 | ||
JPS54105774A (en) * | 1978-02-08 | 1979-08-20 | Hitachi Ltd | Method of forming pattern on thin film hybrid integrated circuit |
JPS594873B2 (ja) * | 1978-09-26 | 1984-02-01 | 松下電器産業株式会社 | 印刷配線板 |
US4345371A (en) * | 1979-03-14 | 1982-08-24 | Sony Corporation | Method and apparatus for manufacturing hybrid integrated circuits |
US4242719A (en) * | 1979-06-01 | 1980-12-30 | Interconnection Technology, Inc. | Solder-weld P.C. board apparatus |
DE2949184A1 (de) * | 1979-12-06 | 1981-07-23 | Siemens AG, 1000 Berlin und 8000 München | Elektrische leiterplatte |
FR2473834A1 (fr) * | 1980-01-11 | 1981-07-17 | Thomson Csf | Procede de soudure automatique de microcomposants sur un circuit imprime, et circuit imprime equipe ainsi realise |
FR2476428A1 (fr) * | 1980-02-15 | 1981-08-21 | Tech Electro Cie Indle | Procede de fixation de composants electroniques sur un circuit imprime et produit obtenu par ce procede |
JPS56167574U (ja) * | 1980-05-14 | 1981-12-11 | ||
JPS5724775U (ja) * | 1980-07-17 | 1982-02-08 | ||
GB2083773B (en) * | 1980-08-01 | 1984-10-24 | Aiwa Co | A soldering method for electric and/or electronic components |
US4549247A (en) * | 1980-11-21 | 1985-10-22 | Gao Gesellschaft Fur Automation Und Organisation Mbh | Carrier element for IC-modules |
US4824010A (en) * | 1980-12-26 | 1989-04-25 | Matsushita Electric Industrial Co., Ltd. | Process and apparatus for soldering printed circuit boards |
DE3104623A1 (de) * | 1981-02-10 | 1982-08-26 | Robert Bosch Gmbh, 7000 Stuttgart | Verfahren zum befestigen von bauelementen mit flaechigen anschlusskontakten und bauelement hierfuer |
US4530457A (en) * | 1982-01-12 | 1985-07-23 | Electrovert Ltd. | Wave-soldering of printed circuit boards |
US4506443A (en) * | 1982-05-28 | 1985-03-26 | Clarion Co., Ltd. | Method of mounting electric part onto a substrate |
WO1984001258A1 (en) * | 1982-09-22 | 1984-03-29 | Matsushita Electric Ind Co Ltd | Device for soldering printed board |
CA1177972A (en) * | 1982-09-23 | 1984-11-13 | Jean P. Berger | Mounting of electronic components on printed circuit boards |
US4515304A (en) * | 1982-09-27 | 1985-05-07 | Northern Telecom Limited | Mounting of electronic components on printed circuit boards |
FR2536901A1 (fr) * | 1982-11-26 | 1984-06-01 | Europ Composants Electron | Condensateur multi-couches de puissance |
US4567543A (en) * | 1983-02-15 | 1986-01-28 | Motorola, Inc. | Double-sided flexible electronic circuit module |
US4573105A (en) * | 1983-02-16 | 1986-02-25 | Rca Corporation | Printed circuit board assembly and method for the manufacture thereof |
GB8322473D0 (en) * | 1983-08-20 | 1983-09-21 | Int Computers Ltd | Printed circuit boards |
FR2556550B1 (fr) * | 1983-12-09 | 1987-01-30 | Lignes Telegraph Telephon | Procede de brasage de composants electroniques sur un circuit imprime et circuit hybride obtenu par ce procede |
US4605987A (en) * | 1983-12-22 | 1986-08-12 | Motorola, Inc. | Method of controlling printed circuit board solder fillets and printed circuit boards including solder fillet control patterns |
US4641222A (en) * | 1984-05-29 | 1987-02-03 | Motorola, Inc. | Mounting system for stress relief in surface mounted components |
US4796079A (en) * | 1984-07-25 | 1989-01-03 | Rca Licensing Corporation | Chip component providing rf suppression |
DE3432360A1 (de) * | 1984-09-03 | 1986-03-13 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zum aendern einer elektrischen flachbaugruppe |
JPS61210601A (ja) * | 1985-03-14 | 1986-09-18 | 進工業株式会社 | チツプ抵抗器 |
USRE33197E (en) * | 1985-05-03 | 1990-04-10 | Electrover Limited | Vibrator wave soldering |
US4682829A (en) * | 1985-06-13 | 1987-07-28 | Amp Incorporated | Surface mount socket for dual in-line package |
US4727633A (en) * | 1985-08-08 | 1988-03-01 | Tektronix, Inc. | Method of securing metallic members together |
US4657172A (en) * | 1985-10-31 | 1987-04-14 | American Microsystems, Inc. | Apparatus and method of solder coating integrated circuit leads |
JP2575109B2 (ja) * | 1985-11-08 | 1997-01-22 | ソニー株式会社 | プリント配線基板 |
US4677396A (en) * | 1985-12-06 | 1987-06-30 | Zenith Electronics Corporation | Surface mounted component UHF oscillator |
US4761881A (en) * | 1986-09-15 | 1988-08-09 | International Business Machines Corporation | Single step solder process |
US4777564A (en) * | 1986-10-16 | 1988-10-11 | Motorola, Inc. | Leadform for use with surface mounted components |
DE3636817A1 (de) * | 1986-10-29 | 1988-05-11 | Mettler Instrumente Ag | Mit bauteilen zum verloeten im loetbad bestueckte leiterplatte |
US4851966A (en) * | 1986-11-10 | 1989-07-25 | Motorola, Inc. | Method and apparatus of printed circuit board assembly with optimal placement of components |
DE3639443A1 (de) * | 1986-11-18 | 1988-05-26 | Ant Nachrichtentech | Leiterplatte und verfahren zu deren herstellung |
US4739917A (en) * | 1987-01-12 | 1988-04-26 | Ford Motor Company | Dual solder process for connecting electrically conducting terminals of electrical components to printed circuit conductors |
JPS63302595A (ja) * | 1987-06-02 | 1988-12-09 | Murata Mfg Co Ltd | チップ部品の取付構造 |
JPS6457789A (en) * | 1987-08-28 | 1989-03-06 | Mitsubishi Electric Corp | Electronic component mounting structure |
DE3810653C1 (ja) * | 1988-03-29 | 1989-05-18 | Dieter Dr.-Ing. Friedrich | |
US4893216A (en) * | 1988-08-09 | 1990-01-09 | Northern Telecom Limited | Circuit board and method of soldering |
US5144535A (en) * | 1989-04-20 | 1992-09-01 | U.S. Philips Corporation | Method of mounting electrical and/or electronic components of a printed circuit board |
US4982376A (en) * | 1989-04-20 | 1991-01-01 | U.S. Philips Corporation | Method of mounting electrical and/or electronic components on a single-sided printed board |
US4998342A (en) * | 1989-08-31 | 1991-03-12 | International Business Machines Corporation | Method of attaching electronic components |
US5214406A (en) * | 1992-02-28 | 1993-05-25 | Littelfuse, Inc. | Surface mounted cartridge fuse |
JPH0669636A (ja) * | 1992-08-17 | 1994-03-11 | Minebea Co Ltd | 部品装着構造と部品装着方法 |
US5493259A (en) * | 1992-10-13 | 1996-02-20 | The Whitaker Corporation | High voltage, low pass filtering connector with multiple ground planes |
US5842275A (en) * | 1995-09-05 | 1998-12-01 | Ford Motor Company | Reflow soldering to mounting pads with vent channels to avoid skewing |
JPH1154237A (ja) * | 1997-08-07 | 1999-02-26 | Yazaki Corp | 配線基板の放電構造 |
US6479763B1 (en) * | 1998-08-28 | 2002-11-12 | Matsushita Electric Industrial Co., Ltd. | Conductive paste, conductive structure using the same, electronic part, module, circuit board, method for electrical connection, method for manufacturing circuit board, and method for manufacturing ceramic electronic part |
JP3636127B2 (ja) * | 2001-10-12 | 2005-04-06 | 松下電器産業株式会社 | 電子部品実装装置および電子部品実装方法 |
US6732905B2 (en) * | 2002-04-16 | 2004-05-11 | Agilent Technologies, Inc. | Vented cavity, hermetic solder seal |
US6924440B2 (en) * | 2003-03-28 | 2005-08-02 | Sony Corporation | Printed wiring board, apparatus for electrically connecting an electronic element and a substrate, and method for manufacturing a printed wiring board |
JP2005243742A (ja) * | 2004-02-24 | 2005-09-08 | Fanuc Ltd | 複数の入力電圧仕様に対応可能なモータ駆動装置 |
JP4825720B2 (ja) * | 2007-04-19 | 2011-11-30 | 矢崎総業株式会社 | プリント配線板 |
US9545009B2 (en) * | 2007-05-23 | 2017-01-10 | Spectra Logic, Corporation | Passive alterable electrical component |
CN201094168Y (zh) * | 2007-09-13 | 2008-07-30 | 鸿富锦精密工业(深圳)有限公司 | 一种电路板 |
JP4927163B2 (ja) * | 2007-12-28 | 2012-05-09 | オーナンバ株式会社 | 端子板回路 |
DE102008015627A1 (de) * | 2008-03-26 | 2009-10-01 | Kiekert Ag | Komponententräger für elektrische/elektronische Bauteile sowie zugehöriges Herstellungsverfahren |
CN102131352A (zh) * | 2010-01-13 | 2011-07-20 | 鸿富锦精密工业(深圳)有限公司 | 一种制造印刷电路板的方法 |
JP5017472B1 (ja) * | 2011-03-16 | 2012-09-05 | 株式会社東芝 | 電子機器 |
JP5741188B2 (ja) * | 2011-04-27 | 2015-07-01 | デクセリアルズ株式会社 | 接続構造体の製造方法 |
US10261370B2 (en) | 2011-10-05 | 2019-04-16 | Apple Inc. | Displays with minimized border regions having an apertured TFT layer for signal conductors |
DE102019215696A1 (de) * | 2019-10-11 | 2021-04-15 | Continental Teves Ag & Co. Ohg | Elektronikeinheit mit verbesserter Kühlung |
EP3905861A1 (de) * | 2020-04-30 | 2021-11-03 | ZKW Group GmbH | Barriere gegen verschwimmen von smt-bauteilen |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS496462A (ja) * | 1972-05-10 | 1974-01-21 | ||
JPS49148586U (ja) * | 1973-04-18 | 1974-12-23 | ||
JPS508493A (ja) * | 1973-05-19 | 1975-01-28 | ||
JPS5015481A (ja) * | 1973-06-08 | 1975-02-18 | ||
JPS5066151A (ja) * | 1973-10-11 | 1975-06-04 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE520059C (de) * | 1926-07-03 | 1931-03-06 | Tracy Loan & Trust Comp Inc | Waschanlage zur chemischen Reinigung von Textilstoffen durch leichtfluechtige fluessige Loesungsmittel |
JPS48114051U (ja) * | 1972-04-01 | 1973-12-26 | ||
DE2228218B1 (de) * | 1972-06-09 | 1973-05-10 | Siemens AG, 1000 Berlin u. 8000 München | Verfahren zum tauchloeten von traegerplaettchen |
DE2319630C3 (de) * | 1973-04-18 | 1979-12-20 | Philips Patentverwaltung Gmbh, 2000 Hamburg | Lötvorrichtung für gedruckte Schaltungen |
JPS5066151U (ja) * | 1973-10-19 | 1975-06-14 | ||
JPS5127053U (ja) * | 1974-08-20 | 1976-02-27 | ||
JPS5174763U (ja) * | 1974-12-06 | 1976-06-11 | ||
US3991347A (en) * | 1975-01-31 | 1976-11-09 | Amp Incorporated | Plated-through hole soldering to filter body |
JPS51142834U (ja) * | 1975-05-13 | 1976-11-17 |
-
1976
- 1976-12-17 JP JP15251676A patent/JPS5376372A/ja active Granted
-
1977
- 1977-12-15 DE DE19772755926 patent/DE2755926A1/de not_active Ceased
- 1977-12-16 US US05/861,447 patent/US4139881A/en not_active Expired - Lifetime
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS496462A (ja) * | 1972-05-10 | 1974-01-21 | ||
JPS49148586U (ja) * | 1973-04-18 | 1974-12-23 | ||
JPS508493A (ja) * | 1973-05-19 | 1975-01-28 | ||
JPS5015481A (ja) * | 1973-06-08 | 1975-02-18 | ||
JPS5066151A (ja) * | 1973-10-11 | 1975-06-04 |
Also Published As
Publication number | Publication date |
---|---|
JPS5376372A (en) | 1978-07-06 |
DE2755926A1 (de) | 1978-06-29 |
US4139881A (en) | 1979-02-13 |