JPS5015481A - - Google Patents

Info

Publication number
JPS5015481A
JPS5015481A JP6381873A JP6381873A JPS5015481A JP S5015481 A JPS5015481 A JP S5015481A JP 6381873 A JP6381873 A JP 6381873A JP 6381873 A JP6381873 A JP 6381873A JP S5015481 A JPS5015481 A JP S5015481A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6381873A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP6381873A priority Critical patent/JPS5015481A/ja
Publication of JPS5015481A publication Critical patent/JPS5015481A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/3205—Shape
    • H01L2224/32057—Shape in side view
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8338—Bonding interfaces outside the semiconductor or solid-state body
    • H01L2224/83385—Shape, e.g. interlocking features
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15151—Shape the die mounting substrate comprising an aperture, e.g. for underfilling, outgassing, window type wire connections

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP6381873A 1973-06-08 1973-06-08 Pending JPS5015481A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6381873A JPS5015481A (ja) 1973-06-08 1973-06-08

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6381873A JPS5015481A (ja) 1973-06-08 1973-06-08

Publications (1)

Publication Number Publication Date
JPS5015481A true JPS5015481A (ja) 1975-02-18

Family

ID=13240315

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6381873A Pending JPS5015481A (ja) 1973-06-08 1973-06-08

Country Status (1)

Country Link
JP (1) JPS5015481A (ja)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5338965U (ja) * 1976-09-08 1978-04-05
JPS5376372A (en) * 1976-12-17 1978-07-06 Matsushita Electric Ind Co Ltd Device for attaching chip circuit parts
JPS53143565U (ja) * 1977-04-18 1978-11-13
JPS546066U (ja) * 1977-06-15 1979-01-16
JPS5459877A (en) * 1977-10-20 1979-05-14 Mitsubishi Electric Corp Production of semiconductor device
JPS5460562A (en) * 1977-10-21 1979-05-16 Mitsubishi Electric Corp Manufacture of semiconductor device
JPS54129023A (en) * 1978-03-30 1979-10-06 Shinto Paint Co Ltd Electrodeposition coating composition for enamel

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5338965U (ja) * 1976-09-08 1978-04-05
JPS5376372A (en) * 1976-12-17 1978-07-06 Matsushita Electric Ind Co Ltd Device for attaching chip circuit parts
JPS5538077B2 (ja) * 1976-12-17 1980-10-02
JPS53143565U (ja) * 1977-04-18 1978-11-13
JPS546066U (ja) * 1977-06-15 1979-01-16
JPS5459877A (en) * 1977-10-20 1979-05-14 Mitsubishi Electric Corp Production of semiconductor device
JPS5460562A (en) * 1977-10-21 1979-05-16 Mitsubishi Electric Corp Manufacture of semiconductor device
JPS54129023A (en) * 1978-03-30 1979-10-06 Shinto Paint Co Ltd Electrodeposition coating composition for enamel

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