JPS4995576A - - Google Patents
Info
- Publication number
- JPS4995576A JPS4995576A JP594573A JP594573A JPS4995576A JP S4995576 A JPS4995576 A JP S4995576A JP 594573 A JP594573 A JP 594573A JP 594573 A JP594573 A JP 594573A JP S4995576 A JPS4995576 A JP S4995576A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/3205—Shape
- H01L2224/32057—Shape in side view
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8338—Bonding interfaces outside the semiconductor or solid-state body
- H01L2224/83385—Shape, e.g. interlocking features
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP594573A JPS4995576A (ja) | 1973-01-12 | 1973-01-12 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP594573A JPS4995576A (ja) | 1973-01-12 | 1973-01-12 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS4995576A true JPS4995576A (ja) | 1974-09-10 |
Family
ID=11625022
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP594573A Pending JPS4995576A (ja) | 1973-01-12 | 1973-01-12 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS4995576A (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS53134658U (ja) * | 1977-03-31 | 1978-10-25 | ||
JPS5437574A (en) * | 1977-08-29 | 1979-03-20 | Nec Home Electronics Ltd | Fabrication method of semiconductor pellet |
-
1973
- 1973-01-12 JP JP594573A patent/JPS4995576A/ja active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS53134658U (ja) * | 1977-03-31 | 1978-10-25 | ||
JPS5437574A (en) * | 1977-08-29 | 1979-03-20 | Nec Home Electronics Ltd | Fabrication method of semiconductor pellet |