JPS5538034A - Manufacturing of semiconductor integrated circuit - Google Patents

Manufacturing of semiconductor integrated circuit

Info

Publication number
JPS5538034A
JPS5538034A JP11079478A JP11079478A JPS5538034A JP S5538034 A JPS5538034 A JP S5538034A JP 11079478 A JP11079478 A JP 11079478A JP 11079478 A JP11079478 A JP 11079478A JP S5538034 A JPS5538034 A JP S5538034A
Authority
JP
Japan
Prior art keywords
region
gate
oxide film
polysilicon
integrated circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11079478A
Other languages
Japanese (ja)
Inventor
Shokichi Yoshitome
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oki Electric Industry Co Ltd
Original Assignee
Oki Electric Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oki Electric Industry Co Ltd filed Critical Oki Electric Industry Co Ltd
Priority to JP11079478A priority Critical patent/JPS5538034A/en
Publication of JPS5538034A publication Critical patent/JPS5538034A/en
Pending legal-status Critical Current

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Abstract

PURPOSE: To realize high stabilization of gate breakdown voltage, by leaving a thick oxide film at the edge of the gate region of MOS semiconductor integrated circuit, and providing polysilicon electrodes in the gate region and the diffused region simultaneously.
CONSTITUTION: Oxide film 3 is formed on the surface of semiconductor base 1, and then, leaving part 31, which is to become gate oxide film, other oxide film 3 on the active region is removed. After this, a source region and a drain region are formed by diffusing an impurity from the surface, and the entire surface is covered with polysilicon 4. Then, the silicon in the parts other than polysilicon layer 4 in the part which is to become a gate electrode and polysilicon 41 on the diffused region is removed; and by implanting ions from the surface, high impurity concentration layer 52 is provided, and after protective film 7, such as PSG film, is grown, this is heat treated. By this, the gate electrode side surface and the source-drain region are partitioned by a thick oxide film, and thereby it is possible to stabilize gate breakdown voltage.
COPYRIGHT: (C)1980,JPO&Japio
JP11079478A 1978-09-11 1978-09-11 Manufacturing of semiconductor integrated circuit Pending JPS5538034A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11079478A JPS5538034A (en) 1978-09-11 1978-09-11 Manufacturing of semiconductor integrated circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11079478A JPS5538034A (en) 1978-09-11 1978-09-11 Manufacturing of semiconductor integrated circuit

Publications (1)

Publication Number Publication Date
JPS5538034A true JPS5538034A (en) 1980-03-17

Family

ID=14544795

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11079478A Pending JPS5538034A (en) 1978-09-11 1978-09-11 Manufacturing of semiconductor integrated circuit

Country Status (1)

Country Link
JP (1) JPS5538034A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57121278A (en) * 1981-01-20 1982-07-28 Sanyo Electric Co Ltd Manufacture of mos type transistor

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5037499A (en) * 1973-06-20 1975-04-08
JPS5284981A (en) * 1976-01-06 1977-07-14 Mitsubishi Electric Corp Production of insulated gate type semiconductor device
JPS5286075A (en) * 1976-01-12 1977-07-16 Sony Corp Formation of minute patterns
JPS5320776A (en) * 1976-08-10 1978-02-25 Mitsubishi Electric Corp Production of metal insulation film semiconductor device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5037499A (en) * 1973-06-20 1975-04-08
JPS5284981A (en) * 1976-01-06 1977-07-14 Mitsubishi Electric Corp Production of insulated gate type semiconductor device
JPS5286075A (en) * 1976-01-12 1977-07-16 Sony Corp Formation of minute patterns
JPS5320776A (en) * 1976-08-10 1978-02-25 Mitsubishi Electric Corp Production of metal insulation film semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57121278A (en) * 1981-01-20 1982-07-28 Sanyo Electric Co Ltd Manufacture of mos type transistor

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