JPS5526658A - Method of forming marker for pattern alignment - Google Patents

Method of forming marker for pattern alignment

Info

Publication number
JPS5526658A
JPS5526658A JP9963378A JP9963378A JPS5526658A JP S5526658 A JPS5526658 A JP S5526658A JP 9963378 A JP9963378 A JP 9963378A JP 9963378 A JP9963378 A JP 9963378A JP S5526658 A JPS5526658 A JP S5526658A
Authority
JP
Japan
Prior art keywords
layer
pattern
film
circuit pattern
marker
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9963378A
Other languages
Japanese (ja)
Other versions
JPS5612015B2 (en
Inventor
Mikio Segawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP9963378A priority Critical patent/JPS5526658A/en
Publication of JPS5526658A publication Critical patent/JPS5526658A/en
Publication of JPS5612015B2 publication Critical patent/JPS5612015B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

PURPOSE: To make a positioning of the patterns easy and in a short time even in working to form a multiplicity of patterns by newly adding a step of making only a circuit pattern except a mark portion plan to a lift-off planing process.
CONSTITUTION: A SiO2 film 12 as a spacer is mounted on the surface of a substrate 11 and an evaporated layer 13 used for a patterned layer is provided thereon further to provide thereon a resist pattern film 14 including a predetermined circuit pattern 14a and a marker pattern 14b. Subsequently, the layer 13 is turned by a patterning into a predetermined pattern, utilizing the film 14 to divide the layer 13 into a circuit pattern 13a and marker pattern 13b. Thereafter, a mesa mask 19 is mounted in the portion except a circuit pattern 18 to form a planing film 15 in the pattern portion 18. Next, the film 14 is removed by a lift-off process, the film 15 on the layer 13a of the circuit pattern is also removed to plane only the layer 13a. Thereafter, an insulation layer 16 is formed on the layer 13a and an upper pattern 17 is provided thereon further.
COPYRIGHT: (C)1980,JPO&Japio
JP9963378A 1978-08-16 1978-08-16 Method of forming marker for pattern alignment Granted JPS5526658A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9963378A JPS5526658A (en) 1978-08-16 1978-08-16 Method of forming marker for pattern alignment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9963378A JPS5526658A (en) 1978-08-16 1978-08-16 Method of forming marker for pattern alignment

Publications (2)

Publication Number Publication Date
JPS5526658A true JPS5526658A (en) 1980-02-26
JPS5612015B2 JPS5612015B2 (en) 1981-03-18

Family

ID=14252470

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9963378A Granted JPS5526658A (en) 1978-08-16 1978-08-16 Method of forming marker for pattern alignment

Country Status (1)

Country Link
JP (1) JPS5526658A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60136687A (en) * 1983-12-14 1985-07-20 東芝プラント建設株式会社 Structure of cable penetrating section
JPH01171988U (en) * 1988-05-26 1989-12-06
JPH0340710A (en) * 1990-02-16 1991-02-21 Toshiba Eng & Constr Co Ltd Structure penetrated with cable
JPH03104365U (en) * 1990-02-09 1991-10-29

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60136687A (en) * 1983-12-14 1985-07-20 東芝プラント建設株式会社 Structure of cable penetrating section
JPH0526408B2 (en) * 1983-12-14 1993-04-16 Toshiba Puranto Kensetsu Kk
JPH01171988U (en) * 1988-05-26 1989-12-06
JPH03104365U (en) * 1990-02-09 1991-10-29
JPH0340710A (en) * 1990-02-16 1991-02-21 Toshiba Eng & Constr Co Ltd Structure penetrated with cable
JPH0527324B2 (en) * 1990-02-16 1993-04-20 Toshiba Puranto Kensetsu Kk

Also Published As

Publication number Publication date
JPS5612015B2 (en) 1981-03-18

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