JPS5522893A - Semiconductor integrated circuit device and its manufacturing method - Google Patents
Semiconductor integrated circuit device and its manufacturing methodInfo
- Publication number
- JPS5522893A JPS5522893A JP9267579A JP9267579A JPS5522893A JP S5522893 A JPS5522893 A JP S5522893A JP 9267579 A JP9267579 A JP 9267579A JP 9267579 A JP9267579 A JP 9267579A JP S5522893 A JPS5522893 A JP S5522893A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- base
- density
- diffusion
- hfe
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Bipolar Transistors (AREA)
- Bipolar Integrated Circuits (AREA)
Abstract
PURPOSE: To improve an hFE or an fT by forming a base layer of a lateral transistor by a diffusion process to provide some density inclination and a base layer of a vertical transistor by a vapor growth process.
CONSTITUTION: A p-epitaxial-layer is vapor-grown in an N-type Si substrate 1 to be covered with an SiO2 5. An opening is given to the film 5, a phosphor diffusion is achieved, to provide an N-layer 2 reaching to the substrate in depth and at the surfacial density of 1016/cm3 and an N+ layer 9 with the surfacial density of 1022/cm3 in the layer 3. In this case, the opening is covered with a thin SiO28 and 9. Successively, an opening is given to a SiO2 5 and 8 selectively, to form a P+ layer 6 and 7 in the layer 2 and 3 by a B-diffusion. At this time, a part of the P+ layer 7 is extended to the N-layer 2 to define a base width W of a lateral transistor and make well and ohmic contact in drawing out a collector electrode and the base electrode of the vertical transistor. Successively, an electrode is formed in the layer 4, 6 and 7. According to such a process, the hFE is raised by a diffusion potential in the lateral element and an accelarating field is caused to improve the fT. On the other hand, because the vertical element has a uniform base density, the hFE and fT can be raised compared with a conventional device.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9267579A JPS5522893A (en) | 1979-07-23 | 1979-07-23 | Semiconductor integrated circuit device and its manufacturing method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9267579A JPS5522893A (en) | 1979-07-23 | 1979-07-23 | Semiconductor integrated circuit device and its manufacturing method |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP50117735A Division JPS5243384A (en) | 1975-10-01 | 1975-10-01 | Composite semiconductor integrated circuit device and process for prod uction of same |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5522893A true JPS5522893A (en) | 1980-02-18 |
JPS5538832B2 JPS5538832B2 (en) | 1980-10-07 |
Family
ID=14061051
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9267579A Granted JPS5522893A (en) | 1979-07-23 | 1979-07-23 | Semiconductor integrated circuit device and its manufacturing method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5522893A (en) |
-
1979
- 1979-07-23 JP JP9267579A patent/JPS5522893A/en active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS5538832B2 (en) | 1980-10-07 |
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