JPS55166933A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS55166933A JPS55166933A JP7468279A JP7468279A JPS55166933A JP S55166933 A JPS55166933 A JP S55166933A JP 7468279 A JP7468279 A JP 7468279A JP 7468279 A JP7468279 A JP 7468279A JP S55166933 A JPS55166933 A JP S55166933A
- Authority
- JP
- Japan
- Prior art keywords
- ceramic
- beryllia
- substrate
- glass layer
- glass
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
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- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
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- H01L2224/321—Disposition
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- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
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- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
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- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
Abstract
PURPOSE:To improve heat radiation by installing a silicon substrate on an insulation substrate in a semiconductor device to be sealed by ceramic package with an intermediate of a beryllia powder containing glass layer. CONSTITUTION:A beryllia containing glass layer 2 is provided in the concaved section on the surface of a ceramic substrate 1, on which a semiconductor pellet 3 of Si or the like is placed, heat-treatment is given and the pellet 3 is adhered to the substrate 1 with an intermediate of the glass layer 2. Then, exterior lead- out leads 5, to be connected to wires 4, and a ceramic case 6 are provided, and the sealing of a ceramic dual in-line package etc. is completed. The glass layer 2 is formed, for instance, by coating a glass paste containing beryllia powder on the ceramic substrate by screen printing and it is baked after it has been dried. As the heat conductivity of the beryllia containing glass is bigger than the ordinary glass by more than one digit, even a high power consuming element can have an excellent heat radiation.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7468279A JPS55166933A (en) | 1979-06-15 | 1979-06-15 | Semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7468279A JPS55166933A (en) | 1979-06-15 | 1979-06-15 | Semiconductor device |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13771785A Division JPS6127641A (en) | 1985-06-26 | 1985-06-26 | Manufacture of integrated circuit device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS55166933A true JPS55166933A (en) | 1980-12-26 |
Family
ID=13554235
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7468279A Pending JPS55166933A (en) | 1979-06-15 | 1979-06-15 | Semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS55166933A (en) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5046484A (en) * | 1973-08-30 | 1975-04-25 | ||
JPS5013554B1 (en) * | 1968-03-24 | 1975-05-20 | ||
JPS535981A (en) * | 1976-07-06 | 1978-01-19 | Toyoda Chuo Kenkyusho Kk | Method of producing semiconductor device |
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1979
- 1979-06-15 JP JP7468279A patent/JPS55166933A/en active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5013554B1 (en) * | 1968-03-24 | 1975-05-20 | ||
JPS5046484A (en) * | 1973-08-30 | 1975-04-25 | ||
JPS535981A (en) * | 1976-07-06 | 1978-01-19 | Toyoda Chuo Kenkyusho Kk | Method of producing semiconductor device |
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