JPS5446477A - Glass-sealed semiconductor device - Google Patents

Glass-sealed semiconductor device

Info

Publication number
JPS5446477A
JPS5446477A JP11310377A JP11310377A JPS5446477A JP S5446477 A JPS5446477 A JP S5446477A JP 11310377 A JP11310377 A JP 11310377A JP 11310377 A JP11310377 A JP 11310377A JP S5446477 A JPS5446477 A JP S5446477A
Authority
JP
Japan
Prior art keywords
glass
paste
lead
filler
capacity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11310377A
Other languages
Japanese (ja)
Inventor
Seiichi Nishino
Koji Nagao
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP11310377A priority Critical patent/JPS5446477A/en
Publication of JPS5446477A publication Critical patent/JPS5446477A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To obtain a sealed device with samll inter-lead capacity which resists high temperature and high humidity, by employing the PbTiQ3 system to the circumferential edge of an external lead-outlead, and low-melting-point glass of lithia porcelain as a filler to other parts.
CONSTITUTION: Powder of PbO-B2O3-Al2O3-SiO2 galss, and PbTiO3 and lithia porcelain is added to the solution, obtained by diluting nitrocellulose with carbitol, by about 2% to obtain paste 1 and paste 2. Paste 1 is arranged at the external circumference of ceramic container 4, and paste 2 is at the part outside it; and lead frame 7 is thermally pressure-welded to the sealed part and after element 6 is mounted on metallized layer, connections 8 are made. Then,cover 3 is placed and the glass is fused by being heated, thereby sealing the divice. Since the entire sealed part almost employs the glass which uses low-permittivity lithia porcelain as a filler, the capacity between leads dereases to one third of the conventional one, and the glass is emplyed at its outside ehich uses lead titanate resisting high-temperature and high-humidity sulofuric acid bath, so that the resistance will not deteriorate
COPYRIGHT: (C)1979,JPO&Japio
JP11310377A 1977-09-19 1977-09-19 Glass-sealed semiconductor device Pending JPS5446477A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11310377A JPS5446477A (en) 1977-09-19 1977-09-19 Glass-sealed semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11310377A JPS5446477A (en) 1977-09-19 1977-09-19 Glass-sealed semiconductor device

Publications (1)

Publication Number Publication Date
JPS5446477A true JPS5446477A (en) 1979-04-12

Family

ID=14603549

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11310377A Pending JPS5446477A (en) 1977-09-19 1977-09-19 Glass-sealed semiconductor device

Country Status (1)

Country Link
JP (1) JPS5446477A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62128155A (en) * 1985-11-29 1987-06-10 Fujitsu Ltd Manufacture of semiconductor device
JP2008044746A (en) * 2006-08-18 2008-02-28 Daido Kogyo Co Ltd Pin tip attachment structure of chain for manufacturing can

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62128155A (en) * 1985-11-29 1987-06-10 Fujitsu Ltd Manufacture of semiconductor device
JP2008044746A (en) * 2006-08-18 2008-02-28 Daido Kogyo Co Ltd Pin tip attachment structure of chain for manufacturing can

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