JPS5516467A - Method of patterning of insulating inorganic film - Google Patents

Method of patterning of insulating inorganic film

Info

Publication number
JPS5516467A
JPS5516467A JP8957478A JP8957478A JPS5516467A JP S5516467 A JPS5516467 A JP S5516467A JP 8957478 A JP8957478 A JP 8957478A JP 8957478 A JP8957478 A JP 8957478A JP S5516467 A JPS5516467 A JP S5516467A
Authority
JP
Japan
Prior art keywords
film
electrode material
opening
photoresist
coated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8957478A
Other languages
Japanese (ja)
Inventor
Hideto Kojima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP8957478A priority Critical patent/JPS5516467A/en
Publication of JPS5516467A publication Critical patent/JPS5516467A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To prevent deterioration of the electrode material by adopting such a production process having the steps of forming a first resist film of a predetermined pattern, forming an inorganic film over the entire surface, forming a second resist film and then effecting an etching on the inorganic film.
CONSTITUTION: An electrode material 3 is formed on a semiconductor substrate 1 coated with an insulating film 2 and a first photoresist film 6 is formed on the electrode material 3 and then patterned in such a manner that the photorresist film 6 remains on the area where the opening is to be formed. Then, the entire surface is coated by, for example, a silicon oxide film 4 which is then coated with a second photoresist film 5 such that the opening of the second photoresist film 5 is positioned in the area where the first resist film 6 remains. Then, the oxide film 4 is etched under the mask of the second photoresist film 5 to form an opening. Then, the first and the second photoresist films 6, 5 are removed by an immersion in a solvent. By so doing, the direct contact between the electrode material 3 and the oxide film 4 is avoided to prevent undesirable phenomenon such as degradation or dissolving of the electrode material 3 at the opening, remaining of the oxide film and so forth.
COPYRIGHT: (C)1980,JPO&Japio
JP8957478A 1978-07-21 1978-07-21 Method of patterning of insulating inorganic film Pending JPS5516467A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8957478A JPS5516467A (en) 1978-07-21 1978-07-21 Method of patterning of insulating inorganic film

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8957478A JPS5516467A (en) 1978-07-21 1978-07-21 Method of patterning of insulating inorganic film

Publications (1)

Publication Number Publication Date
JPS5516467A true JPS5516467A (en) 1980-02-05

Family

ID=13974564

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8957478A Pending JPS5516467A (en) 1978-07-21 1978-07-21 Method of patterning of insulating inorganic film

Country Status (1)

Country Link
JP (1) JPS5516467A (en)

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