JPS55162261A - Semiconductor ic device - Google Patents

Semiconductor ic device

Info

Publication number
JPS55162261A
JPS55162261A JP7033979A JP7033979A JPS55162261A JP S55162261 A JPS55162261 A JP S55162261A JP 7033979 A JP7033979 A JP 7033979A JP 7033979 A JP7033979 A JP 7033979A JP S55162261 A JPS55162261 A JP S55162261A
Authority
JP
Japan
Prior art keywords
wiring
diffused resistor
socket
electrode leadout
crossing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7033979A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6222457B2 (enrdf_load_stackoverflow
Inventor
Kimimaro Yoshikawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP7033979A priority Critical patent/JPS55162261A/ja
Publication of JPS55162261A publication Critical patent/JPS55162261A/ja
Publication of JPS6222457B2 publication Critical patent/JPS6222457B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/60Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D10/00 or H10D18/00, e.g. integration of BJTs
    • H10D84/65Integrated injection logic

Landscapes

  • Bipolar Integrated Circuits (AREA)
  • Bipolar Transistors (AREA)
JP7033979A 1979-06-05 1979-06-05 Semiconductor ic device Granted JPS55162261A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7033979A JPS55162261A (en) 1979-06-05 1979-06-05 Semiconductor ic device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7033979A JPS55162261A (en) 1979-06-05 1979-06-05 Semiconductor ic device

Publications (2)

Publication Number Publication Date
JPS55162261A true JPS55162261A (en) 1980-12-17
JPS6222457B2 JPS6222457B2 (enrdf_load_stackoverflow) 1987-05-18

Family

ID=13428551

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7033979A Granted JPS55162261A (en) 1979-06-05 1979-06-05 Semiconductor ic device

Country Status (1)

Country Link
JP (1) JPS55162261A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58206171A (ja) * 1982-05-26 1983-12-01 Nec Corp 半導体集積回路装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5381093A (en) * 1976-12-27 1978-07-18 Fujitsu Ltd Multiinput-multioutput iil
JPS53105384A (en) * 1977-02-25 1978-09-13 Mitsubishi Electric Corp Semiconductor device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5381093A (en) * 1976-12-27 1978-07-18 Fujitsu Ltd Multiinput-multioutput iil
JPS53105384A (en) * 1977-02-25 1978-09-13 Mitsubishi Electric Corp Semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58206171A (ja) * 1982-05-26 1983-12-01 Nec Corp 半導体集積回路装置

Also Published As

Publication number Publication date
JPS6222457B2 (enrdf_load_stackoverflow) 1987-05-18

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