JPS55160437A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS55160437A
JPS55160437A JP6678579A JP6678579A JPS55160437A JP S55160437 A JPS55160437 A JP S55160437A JP 6678579 A JP6678579 A JP 6678579A JP 6678579 A JP6678579 A JP 6678579A JP S55160437 A JPS55160437 A JP S55160437A
Authority
JP
Japan
Prior art keywords
piece
holes
electrode pieces
thyristor
sized
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6678579A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6119106B2 (enExample
Inventor
Masao Tsuruoka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP6678579A priority Critical patent/JPS55160437A/ja
Priority to US06/154,470 priority patent/US4403242A/en
Publication of JPS55160437A publication Critical patent/JPS55160437A/ja
Publication of JPS6119106B2 publication Critical patent/JPS6119106B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/32—Holders for supporting the complete device in operation, i.e. detachable fixtures
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/492—Bases or plates or solder therefor
    • H01L23/4924—Bases or plates or solder therefor characterised by the materials
    • H01L23/4928—Bases or plates or solder therefor characterised by the materials the materials containing carbon
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    • H01L24/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
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Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Die Bonding (AREA)
  • Thyristors (AREA)
JP6678579A 1979-05-31 1979-05-31 Semiconductor device Granted JPS55160437A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP6678579A JPS55160437A (en) 1979-05-31 1979-05-31 Semiconductor device
US06/154,470 US4403242A (en) 1979-05-31 1980-05-29 Semiconductor device having a metal-fiber composite material electrode

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6678579A JPS55160437A (en) 1979-05-31 1979-05-31 Semiconductor device

Publications (2)

Publication Number Publication Date
JPS55160437A true JPS55160437A (en) 1980-12-13
JPS6119106B2 JPS6119106B2 (enExample) 1986-05-15

Family

ID=13325856

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6678579A Granted JPS55160437A (en) 1979-05-31 1979-05-31 Semiconductor device

Country Status (2)

Country Link
US (1) US4403242A (enExample)
JP (1) JPS55160437A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01315146A (ja) * 1988-03-31 1989-12-20 Toshiba Corp 電力用半導体スイッチ装置

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56131955A (en) * 1980-09-01 1981-10-15 Hitachi Ltd Semiconductor device
US4517585A (en) * 1982-08-13 1985-05-14 Lucas Chloride Ev Systems Limited Heat sink for semi-conductor devices having terminals projecting from a heat sink transfer face
US4614964A (en) * 1984-08-15 1986-09-30 Sundstrand Corporation Coaxial semiconductor package
US4953003A (en) * 1987-05-21 1990-08-28 Siemens Aktiengesellschaft Power semiconductor device
DE59407080D1 (de) * 1993-08-09 1998-11-19 Siemens Ag Leistungs-Halbleiterbauelement mit Druckkontakt
EP1403923A1 (en) * 2002-09-27 2004-03-31 Abb Research Ltd. Press pack power semiconductor module
DE102007041124B4 (de) * 2007-08-30 2009-06-04 Infineon Technologies Ag Thyristor mit verbessertem Einschaltverhalten, Thyristoranordnung mit einem Thyristor, Verfahren zur Herstellung eines Thyristors und einer Thyristoranordnung

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3519896A (en) * 1969-03-11 1970-07-07 Motorola Inc Power transistor assembly
US3654529A (en) * 1971-04-05 1972-04-04 Gen Electric Loose contact press pack
JPS5116302B2 (enExample) * 1973-10-22 1976-05-22
DE2525390A1 (de) * 1975-06-06 1976-12-16 Siemens Ag Steuerbares halbleiterbauelement
NL7604951A (nl) * 1976-05-10 1977-11-14 Philips Nv Glas voor het passiveren van halfgeleider- inrichtingen.
JPS603776B2 (ja) * 1977-06-03 1985-01-30 株式会社日立製作所 半導体素子

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01315146A (ja) * 1988-03-31 1989-12-20 Toshiba Corp 電力用半導体スイッチ装置

Also Published As

Publication number Publication date
JPS6119106B2 (enExample) 1986-05-15
US4403242A (en) 1983-09-06

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