JPS54106171A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS54106171A JPS54106171A JP1246278A JP1246278A JPS54106171A JP S54106171 A JPS54106171 A JP S54106171A JP 1246278 A JP1246278 A JP 1246278A JP 1246278 A JP1246278 A JP 1246278A JP S54106171 A JPS54106171 A JP S54106171A
- Authority
- JP
- Japan
- Prior art keywords
- glass
- substrate
- bonded
- copper
- composite material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Die Bonding (AREA)
- Formation Of Insulating Films (AREA)
Abstract
PURPOSE: To eliminate the crack of the glass protective film by forming the electrode plate with the copper-carbon fiber composite material featuring the thermal expansion coefficient controlled to be almost identical to the semiconductor.
CONSTITUTION: The end area of pn-junction 2 of Si substrate 1 is exposed into circular groove 3 and then coated with the glass film. Support electrode 6 is made of the copper-carbon fiber composite material of a composition of 80% copper and 20% carbon (volume ratio) and bonded to substrate 1. Such composite material produces virtually no stress caused by the difference of the thermal expansion when bonded to Si. Upper electrode 8 is made of the same material as electrode 6 and then bonded on the substrate via solder 7, with the circumference surface covered with resin 9. In such method, no glass crack is caused even with a large-sized substrate. Thus, the glass can function as the stabilizing insulator film, obtaining a resin-coated semiconductor device.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1246278A JPS54106171A (en) | 1978-02-08 | 1978-02-08 | Semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1246278A JPS54106171A (en) | 1978-02-08 | 1978-02-08 | Semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS54106171A true JPS54106171A (en) | 1979-08-20 |
Family
ID=11806013
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1246278A Pending JPS54106171A (en) | 1978-02-08 | 1978-02-08 | Semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS54106171A (en) |
-
1978
- 1978-02-08 JP JP1246278A patent/JPS54106171A/en active Pending
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