JPS54109778A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS54109778A
JPS54109778A JP1653478A JP1653478A JPS54109778A JP S54109778 A JPS54109778 A JP S54109778A JP 1653478 A JP1653478 A JP 1653478A JP 1653478 A JP1653478 A JP 1653478A JP S54109778 A JPS54109778 A JP S54109778A
Authority
JP
Japan
Prior art keywords
ceramics
insulator
constitution
groove
featuring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1653478A
Other languages
Japanese (ja)
Inventor
Masao Tsuruoka
Keiichi Morita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP1653478A priority Critical patent/JPS54109778A/en
Publication of JPS54109778A publication Critical patent/JPS54109778A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/02Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/0603Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions
    • H01L29/0642Isolation within the component, i.e. internal isolation
    • H01L29/0649Dielectric regions, e.g. SiO2 regions, air gaps

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Bipolar Transistors (AREA)
  • Formation Of Insulating Films (AREA)

Abstract

PURPOSE:To ensure the moat glassivation featuring a high external insulation through a simple method of pasting the insulator. CONSTITUTION:The pn-junction J is exposed at convex part 11a of Si pellet 11. Ceramics 17 is bonded onto semiconductor 16 around part 11a concentrically to part 11a, and groove 12 is formed between part 11a and insulator 17. Glass 13 is sintered and filled into groove 12 to protect the pn-junction terminal. In such constitution, the level of ceramics 17 is not higher than the formation surface of ohmic connection 4, so the connection can be performed after end of the high-temperature process such as the glass sintering or the like. Thus, a device featuring a high insulation can be obtained with no evil effect for the contour formation of the mask evaporation method, the photo resist method and others.
JP1653478A 1978-02-17 1978-02-17 Semiconductor device Pending JPS54109778A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1653478A JPS54109778A (en) 1978-02-17 1978-02-17 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1653478A JPS54109778A (en) 1978-02-17 1978-02-17 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS54109778A true JPS54109778A (en) 1979-08-28

Family

ID=11918923

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1653478A Pending JPS54109778A (en) 1978-02-17 1978-02-17 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS54109778A (en)

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