JPS5515286A - Manufacturing method for semiconductor device - Google Patents
Manufacturing method for semiconductor deviceInfo
- Publication number
- JPS5515286A JPS5515286A JP8906478A JP8906478A JPS5515286A JP S5515286 A JPS5515286 A JP S5515286A JP 8906478 A JP8906478 A JP 8906478A JP 8906478 A JP8906478 A JP 8906478A JP S5515286 A JPS5515286 A JP S5515286A
- Authority
- JP
- Japan
- Prior art keywords
- crystal
- layer
- substrate
- film
- back face
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8906478A JPS5515286A (en) | 1978-07-20 | 1978-07-20 | Manufacturing method for semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8906478A JPS5515286A (en) | 1978-07-20 | 1978-07-20 | Manufacturing method for semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5515286A true JPS5515286A (en) | 1980-02-02 |
Family
ID=13960416
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8906478A Pending JPS5515286A (en) | 1978-07-20 | 1978-07-20 | Manufacturing method for semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5515286A (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03222427A (ja) * | 1990-01-29 | 1991-10-01 | Mitsubishi Electric Corp | 半導体装置 |
US6221741B1 (en) | 1997-05-16 | 2001-04-24 | Nec Corporation | Process of fabricating a semiconductor substrate with semi-insulating polysilicon gettering site layer |
-
1978
- 1978-07-20 JP JP8906478A patent/JPS5515286A/ja active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03222427A (ja) * | 1990-01-29 | 1991-10-01 | Mitsubishi Electric Corp | 半導体装置 |
US6221741B1 (en) | 1997-05-16 | 2001-04-24 | Nec Corporation | Process of fabricating a semiconductor substrate with semi-insulating polysilicon gettering site layer |
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