JPS55151899A - Adhering method for piezoelectric converter - Google Patents

Adhering method for piezoelectric converter

Info

Publication number
JPS55151899A
JPS55151899A JP5994479A JP5994479A JPS55151899A JP S55151899 A JPS55151899 A JP S55151899A JP 5994479 A JP5994479 A JP 5994479A JP 5994479 A JP5994479 A JP 5994479A JP S55151899 A JPS55151899 A JP S55151899A
Authority
JP
Japan
Prior art keywords
film
contact
heat
metal film
solid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5994479A
Other languages
Japanese (ja)
Inventor
Yoshinori Oota
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP5994479A priority Critical patent/JPS55151899A/en
Publication of JPS55151899A publication Critical patent/JPS55151899A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
    • H10N30/072—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies
    • H10N30/073—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies by fusion of metals or by adhesives

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Transducers For Ultrasonic Waves (AREA)

Abstract

PURPOSE:To realize the high-grade adhesion which excels in the productivity, by securing a contact between the metal film of a low fusing point provided on one suuface of the piezoelectric converter and the evaporated film of gold or silver provided on one surface of the solid and then applying the pressure and the heat. CONSTITUTION:The vacuum evaporation of In film 3 is given to piezoelectric substance 1. And when necessary thin film 5 of Cr, Nichrome and the like is provided previously. In the same way, Au film 4 is evaporated via thin film 6 of Cr or the like onto solid 2 to which substance 1 is to be adhered. After this, a contact is secured in the air between films 3 and 4 along with application of pressure and then heat. As a result, the diffusion is caused between In and Au by the solid phase reaction, thus the alloy is produced. In this case, the evaporation is possible for the metal film formed into a pattern and using the mask since the contact is given in the air between films 3 and 4. Futhermore, the heat distortion which remains when the metal film is put again under the room temperature can be reduced because the heating temperature is low.
JP5994479A 1979-05-16 1979-05-16 Adhering method for piezoelectric converter Pending JPS55151899A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5994479A JPS55151899A (en) 1979-05-16 1979-05-16 Adhering method for piezoelectric converter

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5994479A JPS55151899A (en) 1979-05-16 1979-05-16 Adhering method for piezoelectric converter

Publications (1)

Publication Number Publication Date
JPS55151899A true JPS55151899A (en) 1980-11-26

Family

ID=13127756

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5994479A Pending JPS55151899A (en) 1979-05-16 1979-05-16 Adhering method for piezoelectric converter

Country Status (1)

Country Link
JP (1) JPS55151899A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014529919A (en) * 2011-06-30 2014-11-13 コミシリア ア レネルジ アトミック エ オ エナジーズ オルタネティヴズ Method for manufacturing high temperature ultrasonic transducers using lithium niobate crystals brazed with gold and indium
CN111799368A (en) * 2020-06-29 2020-10-20 中国科学院上海微系统与信息技术研究所 Preparation method of heterostructure film for reducing film peeling thermal stress

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5266386A (en) * 1975-11-28 1977-06-01 Fujitsu Ltd Production of ultra-sonic oscillator

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5266386A (en) * 1975-11-28 1977-06-01 Fujitsu Ltd Production of ultra-sonic oscillator

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014529919A (en) * 2011-06-30 2014-11-13 コミシリア ア レネルジ アトミック エ オ エナジーズ オルタネティヴズ Method for manufacturing high temperature ultrasonic transducers using lithium niobate crystals brazed with gold and indium
US9425384B2 (en) 2011-06-30 2016-08-23 Commissariat A L'energie Atomique Et Aux Energies Alternatives Method for manufacturing a high-temperature ultrasonic transducer using a lithium niobate crystal brazed with gold and indium
CN111799368A (en) * 2020-06-29 2020-10-20 中国科学院上海微系统与信息技术研究所 Preparation method of heterostructure film for reducing film peeling thermal stress

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