JPS5659234A - Mask reinforcing method - Google Patents

Mask reinforcing method

Info

Publication number
JPS5659234A
JPS5659234A JP13547079A JP13547079A JPS5659234A JP S5659234 A JPS5659234 A JP S5659234A JP 13547079 A JP13547079 A JP 13547079A JP 13547079 A JP13547079 A JP 13547079A JP S5659234 A JPS5659234 A JP S5659234A
Authority
JP
Japan
Prior art keywords
mask
solder
melting point
adhesive layer
holes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13547079A
Other languages
Japanese (ja)
Inventor
Shigetomo Sawada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP13547079A priority Critical patent/JPS5659234A/en
Publication of JPS5659234A publication Critical patent/JPS5659234A/en
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/38—Masks having auxiliary features, e.g. special coatings or marks for alignment or testing; Preparation thereof
    • G03F1/48—Protective coatings

Abstract

PURPOSE:To reinforce a mask and to enhance positioning precision without affecting mask pattern precision, by forming an adhesive layer made of solder between a mask with through holes formed and a reinforcing plate by vapor deposition, and heating it to a temperature below the melting point of the solder in order to stick it with pressing. CONSTITUTION:Mask 1 with through holes formed and reinforcing plate 2 with through holes 2a formed in a size such as not blocking the through holes of mask 1 are laminated interposing adhesive layer 3 made of solder to reinforce them by sticking. At that time the solder is deposited to both the sides of mask 1 and plate 2, or one of them by vapor deposition or sputtering to form adhesive layer 3, and mask 1 and plate 2 laminated interposing layer 3 are heated to a temperature lower than the melting point of the solder and within a few tens of degrees below the melting point and simultaneously pressed to stick them.
JP13547079A 1979-10-19 1979-10-19 Mask reinforcing method Pending JPS5659234A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13547079A JPS5659234A (en) 1979-10-19 1979-10-19 Mask reinforcing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13547079A JPS5659234A (en) 1979-10-19 1979-10-19 Mask reinforcing method

Publications (1)

Publication Number Publication Date
JPS5659234A true JPS5659234A (en) 1981-05-22

Family

ID=15152456

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13547079A Pending JPS5659234A (en) 1979-10-19 1979-10-19 Mask reinforcing method

Country Status (1)

Country Link
JP (1) JPS5659234A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5954929A (en) * 1996-02-15 1999-09-21 Mitsubishi Materials Corporation Deposition-preventing part for physical vapor deposition apparatuses
US6121576A (en) * 1998-09-02 2000-09-19 Micron Technology, Inc. Method and process of contact to a heat softened solder ball array

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5954929A (en) * 1996-02-15 1999-09-21 Mitsubishi Materials Corporation Deposition-preventing part for physical vapor deposition apparatuses
US6121576A (en) * 1998-09-02 2000-09-19 Micron Technology, Inc. Method and process of contact to a heat softened solder ball array
US6329637B1 (en) 1998-09-02 2001-12-11 Micron Technology, Inc. Method and process of contract to a heat softened solder ball array
US6420681B1 (en) 1998-09-02 2002-07-16 Micron Technology, Inc. Method and process of contact to a heat softened solder ball array
US6614003B2 (en) 1998-09-02 2003-09-02 Micron Technology, Inc. Method and process of contact to a heat softened solder ball array
US6967307B2 (en) 1998-09-02 2005-11-22 Micron Technology, Inc. Method and process of contact to a heat softened solder ball array

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