JPS56164560A - Manufacture of reinforcing mask - Google Patents

Manufacture of reinforcing mask

Info

Publication number
JPS56164560A
JPS56164560A JP6736180A JP6736180A JPS56164560A JP S56164560 A JPS56164560 A JP S56164560A JP 6736180 A JP6736180 A JP 6736180A JP 6736180 A JP6736180 A JP 6736180A JP S56164560 A JPS56164560 A JP S56164560A
Authority
JP
Japan
Prior art keywords
foil
mask
reinforcing sheet
joining
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6736180A
Other languages
Japanese (ja)
Inventor
Shigetomo Sawada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP6736180A priority Critical patent/JPS56164560A/en
Publication of JPS56164560A publication Critical patent/JPS56164560A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

PURPOSE:To reduce cost for manufacturing of a mask for a high-density circuit, by placing a brazing foil between a metallic foil and a reinforcing sheet of the same material and joining them together by heating and pressing them in a reductive or inactive atmosphere. CONSTITUTION:Such a brazing material as a silver foil 6 is placed in such a manner as to be caught between such a reinforcing sheet 1 as an Mo sheet, which is provided with a hole for forming of a mask pattern, and a mask material 4 made of an Mo foil. This is heated in a hydrogen furnace at 950 deg.C for 30min and joined by being pressed using a pressing jigs 5 and 5' made of ceramic material. After joining the mask material 4 with the reinforcing sheet 1, the Mo foil and the silver foil are etched for formation of a mask pattern. It is possible, by doing so, to simplify and facilitate joining of the reinforcing sheet 1, and therefore, cost for manufacturing of reinforced metal mask becomes able to be reduced.
JP6736180A 1980-05-21 1980-05-21 Manufacture of reinforcing mask Pending JPS56164560A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6736180A JPS56164560A (en) 1980-05-21 1980-05-21 Manufacture of reinforcing mask

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6736180A JPS56164560A (en) 1980-05-21 1980-05-21 Manufacture of reinforcing mask

Publications (1)

Publication Number Publication Date
JPS56164560A true JPS56164560A (en) 1981-12-17

Family

ID=13342791

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6736180A Pending JPS56164560A (en) 1980-05-21 1980-05-21 Manufacture of reinforcing mask

Country Status (1)

Country Link
JP (1) JPS56164560A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1791176A1 (en) * 2004-08-17 2007-05-30 Mitsubishi Materials Corporation Insulation substrate, power module substrate, manufacturing method thereof, and power module using the same
CN107304467A (en) * 2016-04-19 2017-10-31 上海和辉光电有限公司 A kind of metal mask version manufacturing process and its manufacture device

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1791176A1 (en) * 2004-08-17 2007-05-30 Mitsubishi Materials Corporation Insulation substrate, power module substrate, manufacturing method thereof, and power module using the same
EP1791176A4 (en) * 2004-08-17 2008-07-09 Mitsubishi Materials Corp Insulation substrate, power module substrate, manufacturing method thereof, and power module using the same
US8001682B2 (en) 2004-08-17 2011-08-23 Mitsubishi Materials Corporation Insulation substrate, power module substrate, manufacturing method thereof, and power module using the same
US8188376B2 (en) 2004-08-17 2012-05-29 Mitsubishi Materials Corporation Insulation substrate, power module substrate, manufacturing method thereof, and power module using the same
CN107304467A (en) * 2016-04-19 2017-10-31 上海和辉光电有限公司 A kind of metal mask version manufacturing process and its manufacture device
CN107304467B (en) * 2016-04-19 2019-09-24 上海和辉光电有限公司 A kind of metal mask version manufacturing process and its manufacturing device

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