JPS55150253A - Manufacturing of composite hybrid integrated circuit - Google Patents

Manufacturing of composite hybrid integrated circuit

Info

Publication number
JPS55150253A
JPS55150253A JP5726179A JP5726179A JPS55150253A JP S55150253 A JPS55150253 A JP S55150253A JP 5726179 A JP5726179 A JP 5726179A JP 5726179 A JP5726179 A JP 5726179A JP S55150253 A JPS55150253 A JP S55150253A
Authority
JP
Japan
Prior art keywords
substrate
lead wire
integrated circuit
film
beam lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5726179A
Other languages
Japanese (ja)
Inventor
Hidehiko Kato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP5726179A priority Critical patent/JPS55150253A/en
Publication of JPS55150253A publication Critical patent/JPS55150253A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
    • H01L23/4822—Beam leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Recording Measured Values (AREA)

Abstract

PURPOSE:To obtain a projected beam lead wire by extending the external connection lead wire of a thin film integrated circuit on a spacer film formed at the end of a substrate, removing selectively the spacer film and removing the end of the substrate. CONSTITUTION:A glass layer 2 is formed on an alumina substrate 1, respective heaters 3, bonding layer 4, and a main conductive layer 5 are formed to a conductive lead wire 45, and a protective film 6 is formed thereon. A snap wire 11 is formed perpendicularly to the conductive lead wire 45 on the back surface of the substrate. A spacer film 7 and a beam lead conductor 8 are formed at the end of the conductive lead wire 45 by an ordinary thin film integrated circuit forming process. Subsequently, the film 7 is selectively removed to isolate the beam lead wire 8 from the surface of the substrate. Thereafter, when the substrate and the glass layer are destroyed along the snap line, the beam lead wire 8 is projected from the end of the substrate. In this manner, a high density integrated circuit with beam lead can be obtained.
JP5726179A 1979-05-10 1979-05-10 Manufacturing of composite hybrid integrated circuit Pending JPS55150253A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5726179A JPS55150253A (en) 1979-05-10 1979-05-10 Manufacturing of composite hybrid integrated circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5726179A JPS55150253A (en) 1979-05-10 1979-05-10 Manufacturing of composite hybrid integrated circuit

Publications (1)

Publication Number Publication Date
JPS55150253A true JPS55150253A (en) 1980-11-22

Family

ID=13050577

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5726179A Pending JPS55150253A (en) 1979-05-10 1979-05-10 Manufacturing of composite hybrid integrated circuit

Country Status (1)

Country Link
JP (1) JPS55150253A (en)

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