JPS55150230A - Method of forming metallic pattern for semiconductor device - Google Patents
Method of forming metallic pattern for semiconductor deviceInfo
- Publication number
- JPS55150230A JPS55150230A JP5824879A JP5824879A JPS55150230A JP S55150230 A JPS55150230 A JP S55150230A JP 5824879 A JP5824879 A JP 5824879A JP 5824879 A JP5824879 A JP 5824879A JP S55150230 A JPS55150230 A JP S55150230A
- Authority
- JP
- Japan
- Prior art keywords
- film
- pattern
- forming
- etched
- reverse
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title abstract 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 2
- 229920002120 photoresistant polymer Polymers 0.000 abstract 2
- 239000000758 substrate Substances 0.000 abstract 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract 1
- 239000011248 coating agent Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- 229910052681 coesite Inorganic materials 0.000 abstract 1
- 229910052906 cristobalite Inorganic materials 0.000 abstract 1
- 238000001312 dry etching Methods 0.000 abstract 1
- 239000000463 material Substances 0.000 abstract 1
- 238000001020 plasma etching Methods 0.000 abstract 1
- 230000000717 retained effect Effects 0.000 abstract 1
- 229910052710 silicon Inorganic materials 0.000 abstract 1
- 239000010703 silicon Substances 0.000 abstract 1
- 239000000377 silicon dioxide Substances 0.000 abstract 1
- 235000012239 silicon dioxide Nutrition 0.000 abstract 1
- 229910052682 stishovite Inorganic materials 0.000 abstract 1
- 229910052905 tridymite Inorganic materials 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Drying Of Semiconductors (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5824879A JPS55150230A (en) | 1979-05-11 | 1979-05-11 | Method of forming metallic pattern for semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5824879A JPS55150230A (en) | 1979-05-11 | 1979-05-11 | Method of forming metallic pattern for semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS55150230A true JPS55150230A (en) | 1980-11-22 |
Family
ID=13078813
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5824879A Pending JPS55150230A (en) | 1979-05-11 | 1979-05-11 | Method of forming metallic pattern for semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS55150230A (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6289332A (ja) * | 1985-10-16 | 1987-04-23 | Nec Corp | ドライエツチング方法 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS50153870A (ja) * | 1974-05-30 | 1975-12-11 |
-
1979
- 1979-05-11 JP JP5824879A patent/JPS55150230A/ja active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS50153870A (ja) * | 1974-05-30 | 1975-12-11 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6289332A (ja) * | 1985-10-16 | 1987-04-23 | Nec Corp | ドライエツチング方法 |
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