JPS55132048A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS55132048A
JPS55132048A JP3993479A JP3993479A JPS55132048A JP S55132048 A JPS55132048 A JP S55132048A JP 3993479 A JP3993479 A JP 3993479A JP 3993479 A JP3993479 A JP 3993479A JP S55132048 A JPS55132048 A JP S55132048A
Authority
JP
Japan
Prior art keywords
substrate
fixed
metallic layer
flame coating
roughened
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3993479A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6337496B2 (enExample
Inventor
Toshinobu Sekiba
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP3993479A priority Critical patent/JPS55132048A/ja
Publication of JPS55132048A publication Critical patent/JPS55132048A/ja
Priority to US06/563,884 priority patent/US4542401A/en
Publication of JPS6337496B2 publication Critical patent/JPS6337496B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W70/6875—
    • H10W40/22—
    • H10W72/073—
    • H10W72/07337—
    • H10W72/322—
    • H10W72/352—
    • H10W72/381—
    • H10W90/734—

Landscapes

  • Die Bonding (AREA)
JP3993479A 1979-04-03 1979-04-03 Semiconductor device Granted JPS55132048A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP3993479A JPS55132048A (en) 1979-04-03 1979-04-03 Semiconductor device
US06/563,884 US4542401A (en) 1979-04-03 1983-12-22 Semiconductor device with sprayed metal layer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3993479A JPS55132048A (en) 1979-04-03 1979-04-03 Semiconductor device

Publications (2)

Publication Number Publication Date
JPS55132048A true JPS55132048A (en) 1980-10-14
JPS6337496B2 JPS6337496B2 (enExample) 1988-07-26

Family

ID=12566764

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3993479A Granted JPS55132048A (en) 1979-04-03 1979-04-03 Semiconductor device

Country Status (2)

Country Link
US (1) US4542401A (enExample)
JP (1) JPS55132048A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007013664A1 (en) * 2005-07-27 2007-02-01 Showa Denko K.K. Light-emitting diode light source

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4757934A (en) * 1987-02-06 1988-07-19 Motorola, Inc. Low stress heat sinking for semiconductors
IT1222152B (it) * 1987-07-28 1990-09-05 Sgs Microelettronica Spa Dispositivo a piu' piastrine di materiale in contenitore di metallo e resina
US4799309A (en) * 1987-12-24 1989-01-24 Ford Motor Company Method of making a rectifier and control module for an alternator
NL8800902A (nl) * 1988-04-08 1989-11-01 Philips Nv Werkwijze voor het aanbrengen van een halfgeleiderlichaam op een drager.
EP0434264B1 (en) * 1989-12-22 1994-10-12 Westinghouse Electric Corporation Package for power semiconductor components
US5362680A (en) * 1992-08-18 1994-11-08 Texas Instruments Incorporated Technique for enhancing adhesion capability of heat spreaders in molded packages
US6300167B1 (en) 1994-12-12 2001-10-09 Motorola, Inc. Semiconductor device with flame sprayed heat spreading layer and method
US6099974A (en) * 1997-07-16 2000-08-08 Thermal Spray Technologies, Inc. Coating that enables soldering to non-solderable surfaces
JP4897133B2 (ja) * 1999-12-09 2012-03-14 ソニー株式会社 半導体発光素子、その製造方法および配設基板
US6341848B1 (en) 1999-12-13 2002-01-29 Hewlett-Packard Company Fluid-jet printer having printhead with integrated heat-sink
US20040065432A1 (en) * 2002-10-02 2004-04-08 Smith John R. High performance thermal stack for electrical components
JP2006332204A (ja) * 2005-05-24 2006-12-07 Toto Ltd 静電チャック
CN101896049A (zh) * 2009-05-19 2010-11-24 晟铭电子科技股份有限公司 一种散热模块及其制造方法
JP2011212684A (ja) * 2010-03-31 2011-10-27 Hitachi Ltd 金属接合部材及びその製造方法
DE102014214784A1 (de) * 2014-07-28 2016-02-11 Continental Automotive Gmbh Schaltungsträger, elektronische Baugruppe, Verfahren zum Herstellen eines Schaltungsträgers
DE102018104521B4 (de) 2018-02-28 2022-11-17 Rogers Germany Gmbh Metall-Keramik-Substrate

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52675A (en) * 1975-06-19 1977-01-06 Nippon Fuitsushingutatsukuru K Process for producing fishing rods

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3290564A (en) * 1963-02-26 1966-12-06 Texas Instruments Inc Semiconductor device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52675A (en) * 1975-06-19 1977-01-06 Nippon Fuitsushingutatsukuru K Process for producing fishing rods

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007013664A1 (en) * 2005-07-27 2007-02-01 Showa Denko K.K. Light-emitting diode light source

Also Published As

Publication number Publication date
US4542401A (en) 1985-09-17
JPS6337496B2 (enExample) 1988-07-26

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