JPS55121678A - Charge transfer device - Google Patents
Charge transfer deviceInfo
- Publication number
- JPS55121678A JPS55121678A JP2961979A JP2961979A JPS55121678A JP S55121678 A JPS55121678 A JP S55121678A JP 2961979 A JP2961979 A JP 2961979A JP 2961979 A JP2961979 A JP 2961979A JP S55121678 A JPS55121678 A JP S55121678A
- Authority
- JP
- Japan
- Prior art keywords
- recesses
- transfer device
- charge transfer
- type silicon
- rows
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract 3
- 229910052710 silicon Inorganic materials 0.000 abstract 3
- 239000010703 silicon Substances 0.000 abstract 3
- 230000004888 barrier function Effects 0.000 abstract 1
- 238000005530 etching Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/10—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration
- H01L27/105—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration including field-effect components
- H01L27/1057—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration including field-effect components comprising charge coupled devices [CCD] or charge injection devices [CID]
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Solid State Image Pick-Up Elements (AREA)
Abstract
PURPOSE:To improve the transfer efficiency of a charge transfer device by so providing respective storage regions as to dispose it along the transfer direction of information carrier with barrier means. CONSTITUTION:A low density P-type silicon layer 2 is epitaxially grown on one main surface of a high density N-type silicon substrate 1, and longitudinal holes, that is recess 11-15 and 21-25 of two rows substantially in parallel are formed on the essential surface of the layer 2 by an etching process. Then, an oxide film of predetermined thickness is formed on the surface including the recesses as a gate insulating film 3. Thereafter, a common gate electrode G1 is coated on the silicon layer surface between the adjacent recesses and in the recesses of both rows.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2961979A JPS55121678A (en) | 1979-03-14 | 1979-03-14 | Charge transfer device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2961979A JPS55121678A (en) | 1979-03-14 | 1979-03-14 | Charge transfer device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS55121678A true JPS55121678A (en) | 1980-09-18 |
Family
ID=12281091
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2961979A Pending JPS55121678A (en) | 1979-03-14 | 1979-03-14 | Charge transfer device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS55121678A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS631067A (en) * | 1986-06-20 | 1988-01-06 | Matsushita Electronics Corp | Charge coupled device |
US5083173A (en) * | 1986-11-28 | 1992-01-21 | Matsushita Electronics Corporation | Charge coupled device for a solid state image pick-up device |
-
1979
- 1979-03-14 JP JP2961979A patent/JPS55121678A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS631067A (en) * | 1986-06-20 | 1988-01-06 | Matsushita Electronics Corp | Charge coupled device |
US5083173A (en) * | 1986-11-28 | 1992-01-21 | Matsushita Electronics Corporation | Charge coupled device for a solid state image pick-up device |
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