JPS55115357A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS55115357A JPS55115357A JP2269479A JP2269479A JPS55115357A JP S55115357 A JPS55115357 A JP S55115357A JP 2269479 A JP2269479 A JP 2269479A JP 2269479 A JP2269479 A JP 2269479A JP S55115357 A JPS55115357 A JP S55115357A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- wiring
- ground potential
- potential
- alloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/05001—Internal layers
- H01L2224/05073—Single internal layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05552—Shape in top view
- H01L2224/05554—Shape in top view being square
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01013—Aluminum [Al]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01014—Silicon [Si]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01015—Phosphorus [P]
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electrodes Of Semiconductors (AREA)
- Semiconductor Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2269479A JPS55115357A (en) | 1979-02-28 | 1979-02-28 | Semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2269479A JPS55115357A (en) | 1979-02-28 | 1979-02-28 | Semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS55115357A true JPS55115357A (en) | 1980-09-05 |
Family
ID=12089973
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2269479A Pending JPS55115357A (en) | 1979-02-28 | 1979-02-28 | Semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS55115357A (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58194365A (ja) * | 1982-05-08 | 1983-11-12 | Matsushita Electronics Corp | 半導体装置 |
JPH01186676A (ja) * | 1988-01-14 | 1989-07-26 | Pioneer Electron Corp | 電界効果トランジスタ |
WO2013161249A1 (ja) * | 2012-04-24 | 2013-10-31 | パナソニック株式会社 | 半導体装置 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS53115187A (en) * | 1977-03-18 | 1978-10-07 | Toshiba Corp | Semiconductor device |
-
1979
- 1979-02-28 JP JP2269479A patent/JPS55115357A/ja active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS53115187A (en) * | 1977-03-18 | 1978-10-07 | Toshiba Corp | Semiconductor device |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58194365A (ja) * | 1982-05-08 | 1983-11-12 | Matsushita Electronics Corp | 半導体装置 |
JPH01186676A (ja) * | 1988-01-14 | 1989-07-26 | Pioneer Electron Corp | 電界効果トランジスタ |
WO2013161249A1 (ja) * | 2012-04-24 | 2013-10-31 | パナソニック株式会社 | 半導体装置 |
JPWO2013161249A1 (ja) * | 2012-04-24 | 2015-12-21 | 株式会社ソシオネクスト | 半導体装置 |
US9343461B2 (en) | 2012-04-24 | 2016-05-17 | Socionext Inc. | Semiconductor device including a local wiring connecting diffusion regions |
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