JPS55107774A - Manufacture of tantalum film - Google Patents

Manufacture of tantalum film

Info

Publication number
JPS55107774A
JPS55107774A JP1541779A JP1541779A JPS55107774A JP S55107774 A JPS55107774 A JP S55107774A JP 1541779 A JP1541779 A JP 1541779A JP 1541779 A JP1541779 A JP 1541779A JP S55107774 A JPS55107774 A JP S55107774A
Authority
JP
Japan
Prior art keywords
metallizing
film
sputtering
temp
screws
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1541779A
Other languages
Japanese (ja)
Other versions
JPS6356309B2 (en
Inventor
Masataka Koyama
Minoru Terajima
Kunihiko Tasai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP1541779A priority Critical patent/JPS55107774A/en
Publication of JPS55107774A publication Critical patent/JPS55107774A/en
Publication of JPS6356309B2 publication Critical patent/JPS6356309B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405—Magnetron sputtering
    • H01J37/3408—Planar magnetron sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/0021—Reactive sputtering or evaporation
    • C23C14/0036—Reactive sputtering

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)

Abstract

PURPOSE:To form a metallizing film having arbitrary resistivity and resistance- temp. coefficient, by, in metallizing Ta by use of a magnetron type sputtering apparatus, using Ar gas contg. a specific ratio of nitrogen as a sputtering gas. CONSTITUTION:To permanent magnets 1, 2 is mounted a packing plate 4 with screws 3, then a cathode 5 made of Ta is attached thereon with screws 6. Subsequently cathode seals 7 and anodes 8 are mounted. Sputtering-metallizing by means of the apparatus descrivbed above while applying a voltage and introducing Ar gas contg. 5-95% N2 causes to increase the film-forming rate to thousands of Angstrom /kW, so that a metallizing film having wide range of resistivity and resistance- temp. coefficient is formed under excellent control.
JP1541779A 1979-02-15 1979-02-15 Manufacture of tantalum film Granted JPS55107774A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1541779A JPS55107774A (en) 1979-02-15 1979-02-15 Manufacture of tantalum film

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1541779A JPS55107774A (en) 1979-02-15 1979-02-15 Manufacture of tantalum film

Publications (2)

Publication Number Publication Date
JPS55107774A true JPS55107774A (en) 1980-08-19
JPS6356309B2 JPS6356309B2 (en) 1988-11-08

Family

ID=11888173

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1541779A Granted JPS55107774A (en) 1979-02-15 1979-02-15 Manufacture of tantalum film

Country Status (1)

Country Link
JP (1) JPS55107774A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58197271A (en) * 1982-05-11 1983-11-16 Ulvac Corp Sputtering method of tantalum or the like
FR2567912A1 (en) * 1984-07-20 1986-01-24 Balzers Hochvakuum TARGET PLATE FOR CATHODIC SPRAY
EP0498663A2 (en) * 1991-02-08 1992-08-12 Sharp Kabushiki Kaisha Method for producing a semi conductor device using sputtering
CN113235061A (en) * 2021-05-18 2021-08-10 南昌大学第一附属医院 Preparation process of tantalum metal coating of medical screw

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06144128A (en) * 1992-11-02 1994-05-24 Matsushita Electric Ind Co Ltd Fitting device for on-vehicle electronic apparatus

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58197271A (en) * 1982-05-11 1983-11-16 Ulvac Corp Sputtering method of tantalum or the like
FR2567912A1 (en) * 1984-07-20 1986-01-24 Balzers Hochvakuum TARGET PLATE FOR CATHODIC SPRAY
EP0498663A2 (en) * 1991-02-08 1992-08-12 Sharp Kabushiki Kaisha Method for producing a semi conductor device using sputtering
CN113235061A (en) * 2021-05-18 2021-08-10 南昌大学第一附属医院 Preparation process of tantalum metal coating of medical screw

Also Published As

Publication number Publication date
JPS6356309B2 (en) 1988-11-08

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