JPS55102238A - Apparatus for plasma-gas-phase growth - Google Patents

Apparatus for plasma-gas-phase growth

Info

Publication number
JPS55102238A
JPS55102238A JP1025279A JP1025279A JPS55102238A JP S55102238 A JPS55102238 A JP S55102238A JP 1025279 A JP1025279 A JP 1025279A JP 1025279 A JP1025279 A JP 1025279A JP S55102238 A JPS55102238 A JP S55102238A
Authority
JP
Japan
Prior art keywords
electrodes
walls
partitioning walls
reacted
gas
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1025279A
Other languages
Japanese (ja)
Other versions
JPS5846056B2 (en
Inventor
Tadao Konishi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electronics Corp filed Critical Matsushita Electronics Corp
Priority to JP1025279A priority Critical patent/JPS5846056B2/en
Publication of JPS55102238A publication Critical patent/JPS55102238A/en
Publication of JPS5846056B2 publication Critical patent/JPS5846056B2/en
Expired legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/50Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
    • C23C16/505Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using radio frequency discharges
    • C23C16/509Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using radio frequency discharges using internal electrodes
    • C23C16/5096Flat-bed apparatus

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Formation Of Insulating Films (AREA)

Abstract

PURPOSE:To prevent attachment of residual materials on the unnecessary portions in a chamber , by providing partititoning walls between the peripheries of electrodes and a chamber, and introducing the reacted by-products and non-reacted gas to an exhausting hole from the protion between the peripheries of the electrodes and the partitioning walls. CONSTITUTION:The basic structure is approximately the same as conventional plasma-gas-phase growing apparatuese. Now, quarts partitioning walls 15a-15d are provided around a top rectangualr high frequency electrode 5 so that the walls can be removed and installed freely. By these partitioning walls, are surrounded the peripheries of the top and bottom high-frequency electrodes and the plasma-generating region between said electrodes so as to form one body. In this constitution, the reacted by-products and the non-reacted gas are introduced to an exhausting hole 12 through the portion between the periphery of the bottom electrode and the partitioning walls 15a-15d, and are not attached to an inner wall 3a, the back surface of the top electrode 5, and the like. The removal of the residual material can be made by removing the partitioning walls 15a-15d and chemically treating them. This work is very simple, and the quality of the film which is formed by the gaseous-phase growth is improved.
JP1025279A 1979-01-30 1979-01-30 Plasma vapor phase growth equipment Expired JPS5846056B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1025279A JPS5846056B2 (en) 1979-01-30 1979-01-30 Plasma vapor phase growth equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1025279A JPS5846056B2 (en) 1979-01-30 1979-01-30 Plasma vapor phase growth equipment

Publications (2)

Publication Number Publication Date
JPS55102238A true JPS55102238A (en) 1980-08-05
JPS5846056B2 JPS5846056B2 (en) 1983-10-14

Family

ID=11745116

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1025279A Expired JPS5846056B2 (en) 1979-01-30 1979-01-30 Plasma vapor phase growth equipment

Country Status (1)

Country Link
JP (1) JPS5846056B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08191066A (en) * 1995-10-09 1996-07-23 Canon Inc Deposition film forming method
KR100925568B1 (en) 2007-07-13 2009-11-05 (주)러셀 A chamber of chemical vapor deposition

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08191066A (en) * 1995-10-09 1996-07-23 Canon Inc Deposition film forming method
KR100925568B1 (en) 2007-07-13 2009-11-05 (주)러셀 A chamber of chemical vapor deposition

Also Published As

Publication number Publication date
JPS5846056B2 (en) 1983-10-14

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