JPS5690975A - Sputtering apparatus - Google Patents

Sputtering apparatus

Info

Publication number
JPS5690975A
JPS5690975A JP16852879A JP16852879A JPS5690975A JP S5690975 A JPS5690975 A JP S5690975A JP 16852879 A JP16852879 A JP 16852879A JP 16852879 A JP16852879 A JP 16852879A JP S5690975 A JPS5690975 A JP S5690975A
Authority
JP
Japan
Prior art keywords
vacuum chamber
internal wall
net
wall surface
target
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16852879A
Other languages
Japanese (ja)
Inventor
Kenji Hayakawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP16852879A priority Critical patent/JPS5690975A/en
Publication of JPS5690975A publication Critical patent/JPS5690975A/en
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

PURPOSE:To make it possible to form coating of high quality on the surface of a semiconductor element, by attaching net on the internal wall surface of a vacuum chamber excepting the part where a target is set so as to prevent the formation of microfine dust. CONSTITUTION:Nets 6 made of stainless steel etc. are attached by setting metal fittings 7 to the internal wall surface of a vacuum chamber 1 excepting the part corresponding to a target 5. The mesh of the net is about 0.1mm.-3cm in size. The net restrains the release of fine coating formed on the internal wall surface 1b of the vacuum chamber 1 during operation, or on the surface 4a opposite to the target holder 4, hereby the formation of microfine dust in the vacuum chamber 1 is prevented. Hence high-grade fine coating made of desired metal is formed on the surface of material to be treated e.g. semiconductor element 3.
JP16852879A 1979-12-25 1979-12-25 Sputtering apparatus Pending JPS5690975A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16852879A JPS5690975A (en) 1979-12-25 1979-12-25 Sputtering apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16852879A JPS5690975A (en) 1979-12-25 1979-12-25 Sputtering apparatus

Publications (1)

Publication Number Publication Date
JPS5690975A true JPS5690975A (en) 1981-07-23

Family

ID=15869684

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16852879A Pending JPS5690975A (en) 1979-12-25 1979-12-25 Sputtering apparatus

Country Status (1)

Country Link
JP (1) JPS5690975A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59172165A (en) * 1983-03-18 1984-09-28 Hitachi Maxell Ltd Method and device for producing magnetic recording medium
JPS59222575A (en) * 1983-05-31 1984-12-14 Teijin Ltd Thin film forming device
JPS6155063U (en) * 1984-09-17 1986-04-14
JPS6487768A (en) * 1987-09-29 1989-03-31 Hitachi Ltd Multifunction vacuum plating device
EP2213765A1 (en) * 2009-01-16 2010-08-04 Applied Materials, Inc. Stray coating prevention device, coating chamber device for coating substrates, and method of coating
WO2012052182A1 (en) * 2010-10-21 2012-04-26 Leybold Optics Gmbh Device and process for coating a substrate
US20140342481A1 (en) * 2013-05-16 2014-11-20 Samsung Display Co., Ltd. Organic layer deposition apparatus and method of manufacturing organic light-emitting display apparatus using the same

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59172165A (en) * 1983-03-18 1984-09-28 Hitachi Maxell Ltd Method and device for producing magnetic recording medium
JPS59222575A (en) * 1983-05-31 1984-12-14 Teijin Ltd Thin film forming device
JPS6155063U (en) * 1984-09-17 1986-04-14
JPS6487768A (en) * 1987-09-29 1989-03-31 Hitachi Ltd Multifunction vacuum plating device
EP2213765A1 (en) * 2009-01-16 2010-08-04 Applied Materials, Inc. Stray coating prevention device, coating chamber device for coating substrates, and method of coating
WO2012052182A1 (en) * 2010-10-21 2012-04-26 Leybold Optics Gmbh Device and process for coating a substrate
JP2013544967A (en) * 2010-10-21 2013-12-19 ライボルト オプティクス ゲゼルシャフト ミット ベシュレンクテル ハフツング Apparatus and method for coating the surface of a substrate
US20140342481A1 (en) * 2013-05-16 2014-11-20 Samsung Display Co., Ltd. Organic layer deposition apparatus and method of manufacturing organic light-emitting display apparatus using the same
US11335892B2 (en) 2013-05-16 2022-05-17 Samsung Display Co., Ltd. Organic layer deposition apparatus and method of manufacturing organic light-emitting display apparatus using the same
US11778890B2 (en) 2013-05-16 2023-10-03 Samsung Display Co., Ltd. Organic layer deposition apparatus and method of manufacturing organic light-emitting display apparatus using the same

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