JPS6155063U - - Google Patents

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Publication number
JPS6155063U
JPS6155063U JP13946784U JP13946784U JPS6155063U JP S6155063 U JPS6155063 U JP S6155063U JP 13946784 U JP13946784 U JP 13946784U JP 13946784 U JP13946784 U JP 13946784U JP S6155063 U JPS6155063 U JP S6155063U
Authority
JP
Japan
Prior art keywords
vapor deposition
target
vacuum chamber
attached
deposition apparatus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13946784U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP13946784U priority Critical patent/JPS6155063U/ja
Publication of JPS6155063U publication Critical patent/JPS6155063U/ja
Pending legal-status Critical Current

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  • Physical Vapour Deposition (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案に係る蒸着装置の実施例を示す
正断面図、第２図は実施例で用いるプロテクタシ
ールドの斜視図である。 １…真空室、２…ターゲツト、３…サブストレ
ート、４…プロテクタシールド、５…シールド板
、６…金網。 FIG. 1 is a front sectional view showing an embodiment of a vapor deposition apparatus according to the present invention, and FIG. 2 is a perspective view of a protector shield used in the embodiment. 1... Vacuum chamber, 2... Target, 3... Substrate, 4... Protector shield, 5... Shield plate, 6... Wire mesh.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 真空室内に蒸着物質の粒子を放出するターゲツ
トもしくは蒸発源を配置し、これに対向する位置
に被蒸着物体を配置した蒸着装置において、前記
真空室内に配置されるプロテクタシールドを、シ
ールド板の少なくとも片面上に金網を取り付けた
構成としたことを特徴とする蒸着装置。 In a vapor deposition apparatus in which a target or evaporation source for emitting particles of vapor deposition material is arranged in a vacuum chamber, and an object to be vaporized is arranged in a position opposite to the target, a protector shield arranged in the vacuum chamber is attached to at least one side of the shield plate. A vapor deposition apparatus characterized by having a structure in which a wire mesh is attached on top.
JP13946784U 1984-09-17 1984-09-17 Pending JPS6155063U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13946784U JPS6155063U (en) 1984-09-17 1984-09-17

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13946784U JPS6155063U (en) 1984-09-17 1984-09-17

Publications (1)

Publication Number Publication Date
JPS6155063U true JPS6155063U (en) 1986-04-14

Family

ID=30697846

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13946784U Pending JPS6155063U (en) 1984-09-17 1984-09-17

Country Status (1)

Country Link
JP (1) JPS6155063U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61168816A (en) * 1985-01-18 1986-07-30 セイコーエプソン株式会社 Formation of transparent conducting film

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5690975A (en) * 1979-12-25 1981-07-23 Toshiba Corp Sputtering apparatus

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5690975A (en) * 1979-12-25 1981-07-23 Toshiba Corp Sputtering apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61168816A (en) * 1985-01-18 1986-07-30 セイコーエプソン株式会社 Formation of transparent conducting film

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