JPH0310527U - - Google Patents
Info
- Publication number
- JPH0310527U JPH0310527U JP7110789U JP7110789U JPH0310527U JP H0310527 U JPH0310527 U JP H0310527U JP 7110789 U JP7110789 U JP 7110789U JP 7110789 U JP7110789 U JP 7110789U JP H0310527 U JPH0310527 U JP H0310527U
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- base layer
- electrode base
- thickness
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000010410 layer Substances 0.000 claims description 5
- 239000002344 surface layer Substances 0.000 claims description 3
- 238000009713 electroplating Methods 0.000 claims 1
- 238000005240 physical vapour deposition Methods 0.000 claims 1
- 238000004544 sputter deposition Methods 0.000 claims 1
- 238000007738 vacuum evaporation Methods 0.000 claims 1
Landscapes
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Description
第１図は本考案の一実施例を示す部分断面図、
第２図は本考案の別な実施例を示す部分断面図、
第３図は本考案のさらに別な実施例を示す一部破
断した斜視図、第４図は本考案のさらに別な実施
例を示す斜視図、第５図ａ，ｂは本考案のさらに
別な実施例を示す斜視図、第６図ａ，ｂは本考案
のさらに別な実施例を示す正面図及び斜視図、第
７図ａ，ｂは本考案のさらに別な実施例を示す斜
視図、第８図ａ，ｂ，ｃ，ｄは本考案のさらに別
な実施例を示す斜視図である。
１……電子部品本体、２……電極下地層、３…
…電極表面層、４……外部電極。
FIG. 1 is a partial sectional view showing an embodiment of the present invention;
FIG. 2 is a partial sectional view showing another embodiment of the present invention;
FIG. 3 is a partially broken perspective view showing still another embodiment of the present invention, FIG. 4 is a perspective view showing still another embodiment of the present invention, and FIGS. 5 a and b are still another embodiment of the present invention. FIGS. 6a and 6b are front views and perspective views showing still another embodiment of the present invention, and FIGS. 7a and b are perspective views showing still another embodiment of the present invention. , FIGS. 8a, b, c, and d are perspective views showing still another embodiment of the present invention. 1... Electronic component body, 2... Electrode base layer, 3...
...Electrode surface layer, 4...External electrode.
Claims (1)
着等の物理的蒸着手段によつて極めて薄い膜厚の
電極下地層を形成し、この電極下地層の上に電解
メツキによつて前記電極下地層の膜厚以上の厚み
を有する電極表面層を形成し、前記電極下地層と
電極表面層によつて外部電極を構成したことを特
徴とする電子部品。 An extremely thin electrode base layer is formed on the outer surface of the electronic component body by physical vapor deposition means such as sputtering or vacuum evaporation, and the thickness of the electrode base layer is reduced by electrolytic plating on this electrode base layer. An electronic component characterized in that an electrode surface layer having a thickness greater than or equal to the above thickness is formed, and an external electrode is constituted by the electrode base layer and the electrode surface layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7110789U JPH0310527U (en) | 1989-06-17 | 1989-06-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7110789U JPH0310527U (en) | 1989-06-17 | 1989-06-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0310527U true JPH0310527U (en) | 1991-01-31 |
Family
ID=31607844
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7110789U Pending JPH0310527U (en) | 1989-06-17 | 1989-06-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0310527U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000226689A (en) * | 1999-02-08 | 2000-08-15 | Murata Mfg Co Ltd | Method for forming bump electrode of electronic parts, and electronic parts |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63104314A (en) * | 1986-10-21 | 1988-05-09 | 松下電器産業株式会社 | Method of forming electorode terminal of chip capacitor |
-
1989
- 1989-06-17 JP JP7110789U patent/JPH0310527U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63104314A (en) * | 1986-10-21 | 1988-05-09 | 松下電器産業株式会社 | Method of forming electorode terminal of chip capacitor |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000226689A (en) * | 1999-02-08 | 2000-08-15 | Murata Mfg Co Ltd | Method for forming bump electrode of electronic parts, and electronic parts |