JPH0428479U - - Google Patents
Info
- Publication number
- JPH0428479U JPH0428479U JP7090890U JP7090890U JPH0428479U JP H0428479 U JPH0428479 U JP H0428479U JP 7090890 U JP7090890 U JP 7090890U JP 7090890 U JP7090890 U JP 7090890U JP H0428479 U JPH0428479 U JP H0428479U
- Authority
- JP
- Japan
- Prior art keywords
- base material
- material layers
- electrode
- land
- cut
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims 1
Description
第1図および第2図は本考案の一実施例に係り
、第1図は断面図、第2図は分解斜視図である。
第3図は従来例の断面図である。
1,2……基材層、3……内部電極、4……表
面電極、4a,4b……ランド、5……バイアホ
ール、6……欠如部。
FIGS. 1 and 2 relate to an embodiment of the present invention, with FIG. 1 being a sectional view and FIG. 2 being an exploded perspective view.
FIG. 3 is a sectional view of a conventional example. DESCRIPTION OF SYMBOLS 1, 2... Base material layer, 3... Internal electrode, 4... Surface electrode, 4a, 4b... Land, 5... Via hole, 6... Missing part.
Claims (1)
れたグランド用内部電極3と、基材層1,2の表
面に形成された部品取付用表面電極4とからなる
多層基板であつて、 内部電極3には欠如部6が設けられ、 欠如部6は、表面電極4の各ランド4a,4b
のうち、バイアホール5で内部電極3に接続され
ていないランド4bに対向する個所に形成されて
いる、 ことを特徴とする多層基板。[Claims for Utility Model Registration] Base material layers 1 and 2, internal grounding electrode 3 formed within the base material layers 1 and 2, and component mounting formed on the surfaces of the base material layers 1 and 2. It is a multilayer substrate consisting of a surface electrode 4, in which the internal electrode 3 is provided with a cut-out part 6, and the cut-out part 6 is formed on each land 4a, 4b of the surface electrode 4.
A multilayer board characterized in that the via hole 5 is formed at a location facing the land 4b which is not connected to the internal electrode 3.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7090890U JPH0428479U (en) | 1990-07-02 | 1990-07-02 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7090890U JPH0428479U (en) | 1990-07-02 | 1990-07-02 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0428479U true JPH0428479U (en) | 1992-03-06 |
Family
ID=31607478
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7090890U Pending JPH0428479U (en) | 1990-07-02 | 1990-07-02 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0428479U (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9362886B2 (en) | 2014-09-02 | 2016-06-07 | Seiko Epson Corporation | Electronic component, oscillator, electronic apparatus, and moving object |
JP2018041767A (en) * | 2016-09-05 | 2018-03-15 | アンリツ株式会社 | Waveform-shaping circuit and manufacturing method thereof and pulse pattern generator |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5240776A (en) * | 1975-09-26 | 1977-03-29 | Nippon Electric Co | Film circuit unit |
JPS621412B2 (en) * | 1979-04-23 | 1987-01-13 | Tokuyama Soda Kk |
-
1990
- 1990-07-02 JP JP7090890U patent/JPH0428479U/ja active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5240776A (en) * | 1975-09-26 | 1977-03-29 | Nippon Electric Co | Film circuit unit |
JPS621412B2 (en) * | 1979-04-23 | 1987-01-13 | Tokuyama Soda Kk |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9362886B2 (en) | 2014-09-02 | 2016-06-07 | Seiko Epson Corporation | Electronic component, oscillator, electronic apparatus, and moving object |
US9577604B2 (en) | 2014-09-02 | 2017-02-21 | Seiko Epson Corporation | Electronic component, oscillator, electronic apparatus, and moving object |
JP2018041767A (en) * | 2016-09-05 | 2018-03-15 | アンリツ株式会社 | Waveform-shaping circuit and manufacturing method thereof and pulse pattern generator |