JPH0428479U - - Google Patents

Info

Publication number
JPH0428479U
JPH0428479U JP7090890U JP7090890U JPH0428479U JP H0428479 U JPH0428479 U JP H0428479U JP 7090890 U JP7090890 U JP 7090890U JP 7090890 U JP7090890 U JP 7090890U JP H0428479 U JPH0428479 U JP H0428479U
Authority
JP
Japan
Prior art keywords
base material
material layers
electrode
land
cut
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7090890U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP7090890U priority Critical patent/JPH0428479U/ja
Publication of JPH0428479U publication Critical patent/JPH0428479U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図および第2図は本考案の一実施例に係り
、第1図は断面図、第2図は分解斜視図である。
第3図は従来例の断面図である。 1,2……基材層、3……内部電極、4……表
面電極、4a,4b……ランド、5……バイアホ
ール、6……欠如部。
FIGS. 1 and 2 relate to an embodiment of the present invention, with FIG. 1 being a sectional view and FIG. 2 being an exploded perspective view.
FIG. 3 is a sectional view of a conventional example. DESCRIPTION OF SYMBOLS 1, 2... Base material layer, 3... Internal electrode, 4... Surface electrode, 4a, 4b... Land, 5... Via hole, 6... Missing part.

Claims (1)

【実用新案登録請求の範囲】 基材層1,2と、基材層1,2の層内に形成さ
れたグランド用内部電極3と、基材層1,2の表
面に形成された部品取付用表面電極4とからなる
多層基板であつて、 内部電極3には欠如部6が設けられ、 欠如部6は、表面電極4の各ランド4a,4b
のうち、バイアホール5で内部電極3に接続され
ていないランド4bに対向する個所に形成されて
いる、 ことを特徴とする多層基板。
[Claims for Utility Model Registration] Base material layers 1 and 2, internal grounding electrode 3 formed within the base material layers 1 and 2, and component mounting formed on the surfaces of the base material layers 1 and 2. It is a multilayer substrate consisting of a surface electrode 4, in which the internal electrode 3 is provided with a cut-out part 6, and the cut-out part 6 is formed on each land 4a, 4b of the surface electrode 4.
A multilayer board characterized in that the via hole 5 is formed at a location facing the land 4b which is not connected to the internal electrode 3.
JP7090890U 1990-07-02 1990-07-02 Pending JPH0428479U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7090890U JPH0428479U (en) 1990-07-02 1990-07-02

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7090890U JPH0428479U (en) 1990-07-02 1990-07-02

Publications (1)

Publication Number Publication Date
JPH0428479U true JPH0428479U (en) 1992-03-06

Family

ID=31607478

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7090890U Pending JPH0428479U (en) 1990-07-02 1990-07-02

Country Status (1)

Country Link
JP (1) JPH0428479U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9362886B2 (en) 2014-09-02 2016-06-07 Seiko Epson Corporation Electronic component, oscillator, electronic apparatus, and moving object
JP2018041767A (en) * 2016-09-05 2018-03-15 アンリツ株式会社 Waveform-shaping circuit and manufacturing method thereof and pulse pattern generator

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5240776A (en) * 1975-09-26 1977-03-29 Nippon Electric Co Film circuit unit
JPS621412B2 (en) * 1979-04-23 1987-01-13 Tokuyama Soda Kk

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5240776A (en) * 1975-09-26 1977-03-29 Nippon Electric Co Film circuit unit
JPS621412B2 (en) * 1979-04-23 1987-01-13 Tokuyama Soda Kk

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9362886B2 (en) 2014-09-02 2016-06-07 Seiko Epson Corporation Electronic component, oscillator, electronic apparatus, and moving object
US9577604B2 (en) 2014-09-02 2017-02-21 Seiko Epson Corporation Electronic component, oscillator, electronic apparatus, and moving object
JP2018041767A (en) * 2016-09-05 2018-03-15 アンリツ株式会社 Waveform-shaping circuit and manufacturing method thereof and pulse pattern generator

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