JPH0438106U - - Google Patents
Info
- Publication number
- JPH0438106U JPH0438106U JP8024890U JP8024890U JPH0438106U JP H0438106 U JPH0438106 U JP H0438106U JP 8024890 U JP8024890 U JP 8024890U JP 8024890 U JP8024890 U JP 8024890U JP H0438106 U JPH0438106 U JP H0438106U
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- high dielectric
- dielectric constant
- circuit
- conductive substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 9
- 239000004020 conductor Substances 0.000 claims description 3
Landscapes
- Structure Of Printed Boards (AREA)
- Waveguides (AREA)
Description
第１図は本考案の一実施例を示す断面斜視図、
第２図は従来の分布定数回路構造の一例を示す断
面斜視図である。
１１，２１……プリント基板、１２，２２……
導体基板、１３，２３……高誘電率基板、１４…
…軟質導電体、１５，２５……プリント基板下面
側の回路、１６，２６……プリント基板上面側の
回路、１７，２７……回路部品、１８，２８……
スルーホール、１９……壁部、２４……空間部。
FIG. 1 is a cross-sectional perspective view showing an embodiment of the present invention;
FIG. 2 is a cross-sectional perspective view showing an example of a conventional distributed constant circuit structure. 11, 21... Printed circuit board, 12, 22...
Conductor substrate, 13, 23... High dielectric constant substrate, 14...
...Soft conductor, 15, 25... Circuit on the bottom side of the printed circuit board, 16, 26... Circuit on the top side of the printed board, 17, 27... Circuit components, 18, 28...
Through hole, 19...wall section, 24...space section.
Claims (1)
基板との間に高誘電率基板を有して分布定数回路
を形成する分布定数回路構造において、前記導体
基板上に設けられて前記高誘電率基板の周囲と接
する壁部と、前記導体基板と前記高誘電率基板と
の間に挟み込まれた軟質導電体とを備えたことを
特徴とする分布定数回路構造。 In a distributed constant circuit structure in which a distributed constant circuit is formed by having a high dielectric constant substrate between a circuit formed on the lower surface side of a printed circuit board and a conductive substrate, the high dielectric constant substrate is provided on the conductive substrate. 1. A distributed constant circuit structure comprising: a wall portion in contact with a periphery of the substrate; and a soft conductor sandwiched between the conductive substrate and the high dielectric constant substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8024890U JPH0438106U (en) | 1990-07-27 | 1990-07-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8024890U JPH0438106U (en) | 1990-07-27 | 1990-07-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0438106U true JPH0438106U (en) | 1992-03-31 |
Family
ID=31625134
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8024890U Pending JPH0438106U (en) | 1990-07-27 | 1990-07-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0438106U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5129483U (en) * | 1974-08-21 | 1976-03-03 |
-
1990
- 1990-07-27 JP JP8024890U patent/JPH0438106U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5129483U (en) * | 1974-08-21 | 1976-03-03 |