JPS5490083A - Method of evaluating single crystal - Google Patents

Method of evaluating single crystal

Info

Publication number
JPS5490083A
JPS5490083A JP15903677A JP15903677A JPS5490083A JP S5490083 A JPS5490083 A JP S5490083A JP 15903677 A JP15903677 A JP 15903677A JP 15903677 A JP15903677 A JP 15903677A JP S5490083 A JPS5490083 A JP S5490083A
Authority
JP
Japan
Prior art keywords
wafer
single crystal
dislocation
mum
polished
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15903677A
Other languages
Japanese (ja)
Inventor
Kazutaka Terajima
Hitoshi Mikami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP15903677A priority Critical patent/JPS5490083A/en
Publication of JPS5490083A publication Critical patent/JPS5490083A/en
Pending legal-status Critical Current

Links

Landscapes

  • Crystals, And After-Treatments Of Crystals (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

PURPOSE:To accomplish accurate evaluation of single crysals through an easy, definite detection of dislocation and compound dislocation in an InSb single crystal by selectvely applying an etching electrolyte composed of HF, H2O2 and H2O with a specified mixing ratio. CONSTITUTION:The surface of an InSb single crystal (III) is sliced into a wafer. The wafer thus obtained is polished and then smoothly etched to remove the material by about 80 mum. The wafer thus polished is etched at a room temperature by about 30 mum with an electrolyte composed of 49% HF, 30% H2O2 and H2O within a traingular region made by three points, (1:9:0), (9:1:0:) and (1:3:9:) in the illustrated ternary system. for example at a ratio of 1:2:2. Herein, the etching speed is about 1mum/sec. Then, the surface of the wafer thus treated is observed by an electron microscope. In this manner, compound dislocation can be easily and definitely detected. The composition of the electrolyte lies in the region made by three points, X, Y and Z in the drawing.
JP15903677A 1977-12-28 1977-12-28 Method of evaluating single crystal Pending JPS5490083A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15903677A JPS5490083A (en) 1977-12-28 1977-12-28 Method of evaluating single crystal

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15903677A JPS5490083A (en) 1977-12-28 1977-12-28 Method of evaluating single crystal

Publications (1)

Publication Number Publication Date
JPS5490083A true JPS5490083A (en) 1979-07-17

Family

ID=15684838

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15903677A Pending JPS5490083A (en) 1977-12-28 1977-12-28 Method of evaluating single crystal

Country Status (1)

Country Link
JP (1) JPS5490083A (en)

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