JPS5481146A - Solder flux - Google Patents

Solder flux

Info

Publication number
JPS5481146A
JPS5481146A JP5723278A JP5723278A JPS5481146A JP S5481146 A JPS5481146 A JP S5481146A JP 5723278 A JP5723278 A JP 5723278A JP 5723278 A JP5723278 A JP 5723278A JP S5481146 A JPS5481146 A JP S5481146A
Authority
JP
Japan
Prior art keywords
solder flux
solder
flux
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5723278A
Other languages
English (en)
Other versions
JPS5632079B2 (ja
Inventor
Marijiyan Zadoo Furanku
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Corp
Original Assignee
Western Electric Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Western Electric Co Inc filed Critical Western Electric Co Inc
Publication of JPS5481146A publication Critical patent/JPS5481146A/ja
Publication of JPS5632079B2 publication Critical patent/JPS5632079B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3613—Polymers, e.g. resins

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP5723278A 1977-05-16 1978-05-16 Solder flux Granted JPS5481146A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US79771577A 1977-05-16 1977-05-16
US05/846,464 US4168996A (en) 1977-05-16 1977-10-28 Soldering flux

Publications (2)

Publication Number Publication Date
JPS5481146A true JPS5481146A (en) 1979-06-28
JPS5632079B2 JPS5632079B2 (ja) 1981-07-25

Family

ID=27121923

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5723278A Granted JPS5481146A (en) 1977-05-16 1978-05-16 Solder flux

Country Status (14)

Country Link
US (1) US4168996A (ja)
JP (1) JPS5481146A (ja)
AU (1) AU520659B2 (ja)
CA (1) CA1102963A (ja)
DD (1) DD137073A5 (ja)
DE (1) DE2820656C3 (ja)
ES (1) ES469885A1 (ja)
FR (1) FR2391023A1 (ja)
GB (1) GB1602395A (ja)
HK (1) HK25384A (ja)
IT (1) IT1108146B (ja)
NL (1) NL179634C (ja)
PL (1) PL206764A1 (ja)
SE (1) SE7805216L (ja)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60196291A (ja) * 1984-03-21 1985-10-04 Toshiyuki Oota 低ロジン型はんだ付け用フラツクス
JPWO2008026588A1 (ja) * 2006-08-28 2010-01-21 パナソニック電工株式会社 熱硬化性樹脂組成物及びその製造方法並びに回路基板
JP2010501825A (ja) * 2006-08-28 2010-01-21 ヴァレオ システム テルミク フラットチューブの鑞接方法
WO2023084949A1 (ja) * 2021-11-10 2023-05-19 千住金属工業株式会社 水溶性フラックス及びソルダペースト
JP2023091931A (ja) * 2021-12-21 2023-07-03 千住金属工業株式会社 フラックス生成用固形体及びフラックスの生成方法
JP2023096195A (ja) * 2021-12-21 2023-07-07 千住金属工業株式会社 フラックス生成装置及びフラックス生成方法

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4298407A (en) * 1980-08-04 1981-11-03 E. I. Du Pont De Nemours And Company Flux treated solder powder composition
US4342607A (en) * 1981-01-05 1982-08-03 Western Electric Company, Inc. Solder flux
GB2107362A (en) * 1981-10-16 1983-04-27 Multicore Solders Ltd Liquid fluxes for use in soldering
US4380518A (en) * 1982-01-04 1983-04-19 Western Electric Company, Inc. Method of producing solder spheres
US4428780A (en) 1983-02-07 1984-01-31 Lake Chemical Co. Solutions for use in bonding plates of storage batteries to connecting systems
JPS59222591A (ja) * 1983-06-01 1984-12-14 Nippon Arumitsuto Kk 金属材料の表面活性化剤
US4478650A (en) * 1983-10-19 1984-10-23 At&T Technologies, Inc. Water soluble flux
US4561913A (en) * 1984-03-12 1985-12-31 At&T Technologies, Inc. Soldering flux additive
US4495007A (en) * 1984-03-12 1985-01-22 At&T Technologies, Inc. Soldering flux
US4523712A (en) * 1984-03-12 1985-06-18 At&T Technologies, Inc. Soldering composition and method of soldering therewith
WO1985005307A1 (en) * 1984-05-14 1985-12-05 Kerner Rudolf A Purifiable soft soldering flux based on organic carboxylic acids
SE457335B (sv) * 1984-07-20 1988-12-19 Ytkemiska Inst Flussmedel foer mjukloedning samt foerfarande foer mjukloedning med anvaendning av flussmedlet
US4701224A (en) * 1986-04-21 1987-10-20 American Telephone And Telegraph Company, At&T Bell Laboratories Water soluble condensation soldering flux
DE3713553C1 (de) * 1987-04-23 1988-09-15 Alpha Grillo Lotsysteme Gmbh Halogenfreies Flussmittelgemisch und seine Verwendung
US4988395A (en) * 1989-01-31 1991-01-29 Senju Metal Industry Co., Ltd. Water-soluble soldering flux and paste solder using the flux
US5004508A (en) * 1989-12-12 1991-04-02 International Business Machines Corporation Thermally dissipated soldering flux
US5004509A (en) * 1990-05-04 1991-04-02 Delco Electronics Corporation Low residue soldering flux
DE4033430A1 (de) * 1990-10-20 1992-04-23 Licentia Gmbh Verfahren zum herstellen eines lotmittelauftrags
US5129962A (en) * 1991-10-22 1992-07-14 International Business Machines Corporation Tacky, no-clean thermally dissipated soldering flux
US5507882A (en) * 1994-02-28 1996-04-16 Delco Electronics Corporation Low residue water-based soldering flux and process for soldering with same
EP0753989B1 (en) * 1995-07-11 2005-09-21 Delphi Technologies, Inc. Coatings and methods, especially for circuit boards
DE19964342B4 (de) * 1998-06-10 2008-01-31 Showa Denko K.K. Lötmittelpulver, Flußmittel, Lötmittelpaste, Lötmethode, gelötete Leiterplatte und Lotverbindungsprodukt
US6217671B1 (en) 1999-12-14 2001-04-17 International Business Machines Corporation Composition for increasing activity of a no-clean flux
WO2003064102A1 (en) 2002-01-30 2003-08-07 Showa Denko K.K. Solder metal, soldering flux and solder paste
US7740713B2 (en) * 2004-04-28 2010-06-22 International Business Machines Corporation Flux composition and techniques for use thereof
US20070284412A1 (en) * 2006-05-31 2007-12-13 Prakash Anna M Solder flux composition
US20080156852A1 (en) * 2006-12-29 2008-07-03 Prakash Anna M Solder flux composition and process of using same
US9579738B2 (en) 2011-02-25 2017-02-28 International Business Machines Corporation Flux composition and techniques for use thereof
US9815149B2 (en) 2011-02-25 2017-11-14 International Business Machines Corporation Flux composition and techniques for use thereof
CN104145327A (zh) 2012-02-24 2014-11-12 日立化成株式会社 半导体装置及其制造方法
WO2013125086A1 (ja) * 2012-02-24 2013-08-29 日立化成株式会社 半導体用接着剤、フラックス剤、半導体装置の製造方法及び半導体装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1227825A (fr) * 1958-06-25 1960-08-24 Soudure tubulaire avec décapant intérieur
US3086893A (en) * 1960-10-20 1963-04-23 Nat Lead Co Rosin and bromonated diphenolic acid flux
FR1398332A (fr) * 1964-06-09 1965-05-07 Western Electric Co Fondants activés à base de colophane
US3577284A (en) * 1969-04-07 1971-05-04 Alpha Metals Activated flux
US3734791A (en) * 1970-10-23 1973-05-22 Ibm Surfactant-containing soldering fluxes
DE2154665A1 (de) * 1971-11-03 1973-05-10 Alpha Metals Aktiviertes flussmittelgemisch
US3837932A (en) * 1972-03-27 1974-09-24 Lake Chemical Co Fluxes for use in bonding plates of storage batteries to connecting straps
DE2243374C3 (de) * 1972-09-02 1975-11-13 Stannol-Loetmittelfabrik Wilhelm Paff, 5600 Wuppertal Flußmittel für Weichlote

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60196291A (ja) * 1984-03-21 1985-10-04 Toshiyuki Oota 低ロジン型はんだ付け用フラツクス
JPWO2008026588A1 (ja) * 2006-08-28 2010-01-21 パナソニック電工株式会社 熱硬化性樹脂組成物及びその製造方法並びに回路基板
JP2010501825A (ja) * 2006-08-28 2010-01-21 ヴァレオ システム テルミク フラットチューブの鑞接方法
JP5411503B2 (ja) * 2006-08-28 2014-02-12 パナソニック株式会社 熱硬化性樹脂組成物及びその製造方法並びに回路基板
US8697237B2 (en) 2006-08-28 2014-04-15 Panasonic Corporation Thermosetting resin composition, method of manufacturing the same and circuit board
WO2023084949A1 (ja) * 2021-11-10 2023-05-19 千住金属工業株式会社 水溶性フラックス及びソルダペースト
JP2023091931A (ja) * 2021-12-21 2023-07-03 千住金属工業株式会社 フラックス生成用固形体及びフラックスの生成方法
JP2023096195A (ja) * 2021-12-21 2023-07-07 千住金属工業株式会社 フラックス生成装置及びフラックス生成方法

Also Published As

Publication number Publication date
ES469885A1 (es) 1979-09-16
JPS5632079B2 (ja) 1981-07-25
AU3600578A (en) 1979-11-15
DE2820656C3 (de) 1982-03-04
DD137073A5 (de) 1979-08-15
GB1602395A (en) 1981-11-11
IT1108146B (it) 1985-12-02
PL206764A1 (pl) 1979-02-12
FR2391023A1 (fr) 1978-12-15
AU520659B2 (en) 1982-02-18
DE2820656A1 (de) 1978-11-30
SE7805216L (sv) 1978-11-17
US4168996A (en) 1979-09-25
FR2391023B1 (ja) 1980-06-13
IT7868116A0 (it) 1978-05-15
DE2820656B2 (de) 1980-11-13
CA1102963A (en) 1981-06-16
HK25384A (en) 1984-03-30
NL179634C (nl) 1986-10-16
NL7805123A (nl) 1978-11-20

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