JPS52142643A - Solder piece - Google Patents

Solder piece

Info

Publication number
JPS52142643A
JPS52142643A JP5926076A JP5926076A JPS52142643A JP S52142643 A JPS52142643 A JP S52142643A JP 5926076 A JP5926076 A JP 5926076A JP 5926076 A JP5926076 A JP 5926076A JP S52142643 A JPS52142643 A JP S52142643A
Authority
JP
Japan
Prior art keywords
solder piece
solder
piece
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5926076A
Other languages
Japanese (ja)
Inventor
Hidetaka Ikuma
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP5926076A priority Critical patent/JPS52142643A/en
Publication of JPS52142643A publication Critical patent/JPS52142643A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
    • H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
JP5926076A 1976-05-22 1976-05-22 Solder piece Pending JPS52142643A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5926076A JPS52142643A (en) 1976-05-22 1976-05-22 Solder piece

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5926076A JPS52142643A (en) 1976-05-22 1976-05-22 Solder piece

Publications (1)

Publication Number Publication Date
JPS52142643A true JPS52142643A (en) 1977-11-28

Family

ID=13108215

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5926076A Pending JPS52142643A (en) 1976-05-22 1976-05-22 Solder piece

Country Status (1)

Country Link
JP (1) JPS52142643A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5350032A (en) * 1976-10-18 1978-05-08 Mitsubishi Electric Corp Eutectic alloy solder structure
JPS5462949A (en) * 1977-10-28 1979-05-21 Matsushita Electronics Corp Soldering material for semiconductive base plate
JPS5548494A (en) * 1978-10-04 1980-04-07 Sumitomo Metal Mining Co Ltd Working method for gold solder
JPS5851584A (en) * 1981-09-24 1983-03-26 Hitachi Ltd Mounting structure of compound semiconductor element
JPH02241690A (en) * 1989-03-10 1990-09-26 Tanaka Kikinzoku Kogyo Kk Laminated brazing filler metal
JPH03273650A (en) * 1990-03-23 1991-12-04 Nec Corp Solder for semiconductor device

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5350032A (en) * 1976-10-18 1978-05-08 Mitsubishi Electric Corp Eutectic alloy solder structure
JPS5462949A (en) * 1977-10-28 1979-05-21 Matsushita Electronics Corp Soldering material for semiconductive base plate
JPS5548494A (en) * 1978-10-04 1980-04-07 Sumitomo Metal Mining Co Ltd Working method for gold solder
JPS5851584A (en) * 1981-09-24 1983-03-26 Hitachi Ltd Mounting structure of compound semiconductor element
JPH02241690A (en) * 1989-03-10 1990-09-26 Tanaka Kikinzoku Kogyo Kk Laminated brazing filler metal
JPH03273650A (en) * 1990-03-23 1991-12-04 Nec Corp Solder for semiconductor device

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