JPS544259A - Thick soldering device - Google Patents

Thick soldering device

Info

Publication number
JPS544259A
JPS544259A JP6967577A JP6967577A JPS544259A JP S544259 A JPS544259 A JP S544259A JP 6967577 A JP6967577 A JP 6967577A JP 6967577 A JP6967577 A JP 6967577A JP S544259 A JPS544259 A JP S544259A
Authority
JP
Japan
Prior art keywords
soldering device
thick
thick soldering
soldering
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6967577A
Other languages
Japanese (ja)
Other versions
JPS5760790B2 (en
Inventor
Kazuo Abe
Hiroo Okuyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HOPE SEIKI
Original Assignee
HOPE SEIKI
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by HOPE SEIKI filed Critical HOPE SEIKI
Priority to JP6967577A priority Critical patent/JPS544259A/en
Publication of JPS544259A publication Critical patent/JPS544259A/en
Publication of JPS5760790B2 publication Critical patent/JPS5760790B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Molten Solder (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP6967577A 1977-06-13 1977-06-13 Thick soldering device Granted JPS544259A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6967577A JPS544259A (en) 1977-06-13 1977-06-13 Thick soldering device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6967577A JPS544259A (en) 1977-06-13 1977-06-13 Thick soldering device

Publications (2)

Publication Number Publication Date
JPS544259A true JPS544259A (en) 1979-01-12
JPS5760790B2 JPS5760790B2 (en) 1982-12-21

Family

ID=13409654

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6967577A Granted JPS544259A (en) 1977-06-13 1977-06-13 Thick soldering device

Country Status (1)

Country Link
JP (1) JPS544259A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5918697A (en) * 1982-07-21 1984-01-31 大日本スクリ−ン製造株式会社 Excess solder removing device in solder plating device of printed circuit board
JPS611467A (en) * 1984-06-12 1986-01-07 Hoopu Seiki Kk Solder coating device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5918697A (en) * 1982-07-21 1984-01-31 大日本スクリ−ン製造株式会社 Excess solder removing device in solder plating device of printed circuit board
JPH0115155B2 (en) * 1982-07-21 1989-03-15 Dainippon Screen Mfg
JPS611467A (en) * 1984-06-12 1986-01-07 Hoopu Seiki Kk Solder coating device

Also Published As

Publication number Publication date
JPS5760790B2 (en) 1982-12-21

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