JPS544259A - Thick soldering device - Google Patents
Thick soldering deviceInfo
- Publication number
- JPS544259A JPS544259A JP6967577A JP6967577A JPS544259A JP S544259 A JPS544259 A JP S544259A JP 6967577 A JP6967577 A JP 6967577A JP 6967577 A JP6967577 A JP 6967577A JP S544259 A JPS544259 A JP S544259A
- Authority
- JP
- Japan
- Prior art keywords
- soldering device
- thick
- thick soldering
- soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Molten Solder (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6967577A JPS544259A (en) | 1977-06-13 | 1977-06-13 | Thick soldering device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6967577A JPS544259A (en) | 1977-06-13 | 1977-06-13 | Thick soldering device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS544259A true JPS544259A (en) | 1979-01-12 |
JPS5760790B2 JPS5760790B2 (en) | 1982-12-21 |
Family
ID=13409654
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6967577A Granted JPS544259A (en) | 1977-06-13 | 1977-06-13 | Thick soldering device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS544259A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5918697A (en) * | 1982-07-21 | 1984-01-31 | 大日本スクリ−ン製造株式会社 | Excess solder removing device in solder plating device of printed circuit board |
JPS611467A (en) * | 1984-06-12 | 1986-01-07 | Hoopu Seiki Kk | Solder coating device |
-
1977
- 1977-06-13 JP JP6967577A patent/JPS544259A/en active Granted
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5918697A (en) * | 1982-07-21 | 1984-01-31 | 大日本スクリ−ン製造株式会社 | Excess solder removing device in solder plating device of printed circuit board |
JPH0115155B2 (en) * | 1982-07-21 | 1989-03-15 | Dainippon Screen Mfg | |
JPS611467A (en) * | 1984-06-12 | 1986-01-07 | Hoopu Seiki Kk | Solder coating device |
Also Published As
Publication number | Publication date |
---|---|
JPS5760790B2 (en) | 1982-12-21 |
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