JPS546768A - Manufacture of semiconductor device - Google Patents

Manufacture of semiconductor device

Info

Publication number
JPS546768A
JPS546768A JP7245977A JP7245977A JPS546768A JP S546768 A JPS546768 A JP S546768A JP 7245977 A JP7245977 A JP 7245977A JP 7245977 A JP7245977 A JP 7245977A JP S546768 A JPS546768 A JP S546768A
Authority
JP
Japan
Prior art keywords
manufacture
semiconductor device
refuse
laser beam
scribing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7245977A
Other languages
Japanese (ja)
Other versions
JPS5931983B2 (en
Inventor
Nobuyuki Yamamichi
Masashi Mukogawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP52072459A priority Critical patent/JPS5931983B2/en
Publication of JPS546768A publication Critical patent/JPS546768A/en
Publication of JPS5931983B2 publication Critical patent/JPS5931983B2/en
Expired legal-status Critical Current

Links

Landscapes

  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Laser Beam Processing (AREA)
  • Dicing (AREA)

Abstract

PURPOSE: To avoid the short circuit caused by a contact to the bonding wire and thus to increase the production yield, by scribing the wafer via the laser beam and furthermore irradiating the laser beam of reduced intensity to the area where the refuse is stuck to lower the height of the refuse.
COPYRIGHT: (C)1979,JPO&Japio
JP52072459A 1977-06-17 1977-06-17 Manufacturing method of semiconductor device Expired JPS5931983B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP52072459A JPS5931983B2 (en) 1977-06-17 1977-06-17 Manufacturing method of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP52072459A JPS5931983B2 (en) 1977-06-17 1977-06-17 Manufacturing method of semiconductor device

Publications (2)

Publication Number Publication Date
JPS546768A true JPS546768A (en) 1979-01-19
JPS5931983B2 JPS5931983B2 (en) 1984-08-06

Family

ID=13489899

Family Applications (1)

Application Number Title Priority Date Filing Date
JP52072459A Expired JPS5931983B2 (en) 1977-06-17 1977-06-17 Manufacturing method of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5931983B2 (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5840840A (en) * 1981-09-03 1983-03-09 Nec Corp Semiconductor device and manufacture thereof
JPS6195898A (en) * 1984-10-15 1986-05-14 甲南設計工業株式会社 Method of removing whitening and burr of rigid polyvinyl chloride resin material
JP2005317927A (en) * 2004-03-31 2005-11-10 Mitsubishi Materials Corp Chip resistor
JP2006128480A (en) * 2004-10-29 2006-05-18 Taiyosha Electric Co Ltd Chip resistor manufacturing method
JP2007150197A (en) * 2005-11-30 2007-06-14 Rohm Co Ltd Chip type electronic component
JP2010225910A (en) * 2009-03-24 2010-10-07 Ngk Spark Plug Co Ltd Multiple patterning ceramic wiring board
JP2012151195A (en) * 2011-01-18 2012-08-09 Panasonic Corp Method for manufacturing chip resistor
WO2024111494A1 (en) * 2022-11-22 2024-05-30 株式会社大真空 Thin-plate thermistor and thin-plate thermistor-mounted piezoelectric vibration device

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5840840A (en) * 1981-09-03 1983-03-09 Nec Corp Semiconductor device and manufacture thereof
JPS6195898A (en) * 1984-10-15 1986-05-14 甲南設計工業株式会社 Method of removing whitening and burr of rigid polyvinyl chloride resin material
JP2005317927A (en) * 2004-03-31 2005-11-10 Mitsubishi Materials Corp Chip resistor
JP2006128480A (en) * 2004-10-29 2006-05-18 Taiyosha Electric Co Ltd Chip resistor manufacturing method
JP4602738B2 (en) * 2004-10-29 2010-12-22 太陽社電気株式会社 Manufacturing method of chip resistor
JP2007150197A (en) * 2005-11-30 2007-06-14 Rohm Co Ltd Chip type electronic component
JP2010225910A (en) * 2009-03-24 2010-10-07 Ngk Spark Plug Co Ltd Multiple patterning ceramic wiring board
JP2012151195A (en) * 2011-01-18 2012-08-09 Panasonic Corp Method for manufacturing chip resistor
WO2024111494A1 (en) * 2022-11-22 2024-05-30 株式会社大真空 Thin-plate thermistor and thin-plate thermistor-mounted piezoelectric vibration device

Also Published As

Publication number Publication date
JPS5931983B2 (en) 1984-08-06

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