JPS546768A - Manufacture of semiconductor device - Google Patents
Manufacture of semiconductor deviceInfo
- Publication number
- JPS546768A JPS546768A JP7245977A JP7245977A JPS546768A JP S546768 A JPS546768 A JP S546768A JP 7245977 A JP7245977 A JP 7245977A JP 7245977 A JP7245977 A JP 7245977A JP S546768 A JPS546768 A JP S546768A
- Authority
- JP
- Japan
- Prior art keywords
- manufacture
- semiconductor device
- refuse
- laser beam
- scribing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
- Laser Beam Processing (AREA)
- Dicing (AREA)
Abstract
PURPOSE: To avoid the short circuit caused by a contact to the bonding wire and thus to increase the production yield, by scribing the wafer via the laser beam and furthermore irradiating the laser beam of reduced intensity to the area where the refuse is stuck to lower the height of the refuse.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP52072459A JPS5931983B2 (en) | 1977-06-17 | 1977-06-17 | Manufacturing method of semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP52072459A JPS5931983B2 (en) | 1977-06-17 | 1977-06-17 | Manufacturing method of semiconductor device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS546768A true JPS546768A (en) | 1979-01-19 |
JPS5931983B2 JPS5931983B2 (en) | 1984-08-06 |
Family
ID=13489899
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP52072459A Expired JPS5931983B2 (en) | 1977-06-17 | 1977-06-17 | Manufacturing method of semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5931983B2 (en) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5840840A (en) * | 1981-09-03 | 1983-03-09 | Nec Corp | Semiconductor device and manufacture thereof |
JPS6195898A (en) * | 1984-10-15 | 1986-05-14 | 甲南設計工業株式会社 | Method of removing whitening and burr of rigid polyvinyl chloride resin material |
JP2005317927A (en) * | 2004-03-31 | 2005-11-10 | Mitsubishi Materials Corp | Chip resistor |
JP2006128480A (en) * | 2004-10-29 | 2006-05-18 | Taiyosha Electric Co Ltd | Chip resistor manufacturing method |
JP2007150197A (en) * | 2005-11-30 | 2007-06-14 | Rohm Co Ltd | Chip type electronic component |
JP2010225910A (en) * | 2009-03-24 | 2010-10-07 | Ngk Spark Plug Co Ltd | Multiple patterning ceramic wiring board |
JP2012151195A (en) * | 2011-01-18 | 2012-08-09 | Panasonic Corp | Method for manufacturing chip resistor |
WO2024111494A1 (en) * | 2022-11-22 | 2024-05-30 | 株式会社大真空 | Thin-plate thermistor and thin-plate thermistor-mounted piezoelectric vibration device |
-
1977
- 1977-06-17 JP JP52072459A patent/JPS5931983B2/en not_active Expired
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5840840A (en) * | 1981-09-03 | 1983-03-09 | Nec Corp | Semiconductor device and manufacture thereof |
JPS6195898A (en) * | 1984-10-15 | 1986-05-14 | 甲南設計工業株式会社 | Method of removing whitening and burr of rigid polyvinyl chloride resin material |
JP2005317927A (en) * | 2004-03-31 | 2005-11-10 | Mitsubishi Materials Corp | Chip resistor |
JP2006128480A (en) * | 2004-10-29 | 2006-05-18 | Taiyosha Electric Co Ltd | Chip resistor manufacturing method |
JP4602738B2 (en) * | 2004-10-29 | 2010-12-22 | 太陽社電気株式会社 | Manufacturing method of chip resistor |
JP2007150197A (en) * | 2005-11-30 | 2007-06-14 | Rohm Co Ltd | Chip type electronic component |
JP2010225910A (en) * | 2009-03-24 | 2010-10-07 | Ngk Spark Plug Co Ltd | Multiple patterning ceramic wiring board |
JP2012151195A (en) * | 2011-01-18 | 2012-08-09 | Panasonic Corp | Method for manufacturing chip resistor |
WO2024111494A1 (en) * | 2022-11-22 | 2024-05-30 | 株式会社大真空 | Thin-plate thermistor and thin-plate thermistor-mounted piezoelectric vibration device |
Also Published As
Publication number | Publication date |
---|---|
JPS5931983B2 (en) | 1984-08-06 |
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